Staff Engineer, NTI Metrology

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is seeking a senior metrology development professional to lead the development, qualification, and deployment of advanced metrology applications for 3D NAND process development.

Focus will be on FIB and supported by AFM, SEM or WLI. You will drive evaluation of next-generation metrology systems, assess capability, accuracy, and throughput, and collaborate with equipment suppliers to roadmap technology for future NAND processes.

Qualifications

• Master's or PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.

Responsibilities

• Own the development, qualification, and deployment of advanced metrology applications for 3D NAND process development, with primary emphasis on FIB and one or more of AFM, SEM, or WLI.
• Develop and implement innovative metrology solutions utilizing FIB, AFM, SEM, and related techniques to close inline detection gaps and accelerate process learning.
• Lead evaluation, qualification, and deployment of FOAK technologies across FIB, AFM, SEM, WLI, and other metrology platforms.
• Establish technology roadmaps aligned with NAND technology requirements and collaborate with suppliers and industry partners.
• Identify modeling opportunities using metrology data analytics, AI, and ML to understand electrical failure signatures and impact on yield and reliability.
• Collaborate with Process Integration, Yield Enhancement, Process Development Engineering and Manufacturing teams to enable rapid deployment of characterization solutions.

Education

Master's or PhD in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics

Tools

Focused Ion Beam (FIB)

Atomic Force Microscopy (AFM)

Scanning Electron Microscopy (SEM)

White Light Interferometry (WLI)

AI/ML in metrology

Job description

Responsibilities:

• Own the development, qualification, and deployment of advanced metrology applications for 3D NAND process development, with primary emphasis on Focused Ion Beam (FIB) and one or more of the following:




• Atomic Force Microscopy (AFM)




• Optical interferometry or White Light Interferometry (WLI)




• Scanning Electron Microscopy (SEM)




• Semiconductor electrical or non-contact characterization methods




• Develop and implement innovative metrology solutions utilizing FIB, AFM, SEM, and related characterization techniques to close inline detection gaps and accelerate process learning.




• Lead the evaluation, qualification, and deployment of next-generation metrology systems and First-of-a-Kind (FOAK) technologies, including assessment of measurement capability, accuracy, repeatability, throughput, automation, and manufacturing readiness across FIB, AFM, SEM, and other advanced metrology platforms.




• Establish and drive technology roadmaps, ensuring alignment with future NAND technology requirements while fostering strong technical partnerships with equipment suppliers and industry collaborators.




• Identify and develop modeling opportunities using metrology, defect detection, artificial intelligence (AI), and machine learning (ML) techniques in conjunction with metrology data analytics to understand electrical failure signatures observed at probe and their impact on product reliability, yield, and performance.




• Collaborate closely with Process Integration, Yield Enhancement, Process Development Engineering and Manufacturing teams to develop innovative characterization solutions and enable rapid technology deployment

Qualifications:

• Master's or PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.




• Minimum 7 years of semiconductor metrology development experience with demonstrated ownership and experience developing new metrology applications, recipes, methodologies or inline monitoring solutionsacross advanced characterization platforms, including FIB and one or more of the following: AFM, SEM, or WLI (not users of Metrology data).




• Minimum 5 years of hands‑on experience in Focused Ion Beam (FIB) and at least one additional advanced metrology technique from the following




• Atomic Force Microscopy (AFM)




• While Light Interferometry (WLI)




• Scanning Electron Microscopy (SEM)




• Demonstrated track record developing advanced semiconductor metrology applications for process characterization, inline monitoring, root‑cause analysis, yield improvement, reliability investigations, and technology transfer, including qualification of new metrology technologies and direct engagement with suppliers to establish application capability and technology roadmaps.




• Candidates whose experience is primarily limited to process engineering, yield engineering, failure analysis, or data analysis roles without direct metrology application development responsibility will not be considered.