Senior / Engineer - NPI

COPPERCO TALENT SERVICES PTE. LTD.; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Copperco Talent Services Pte. Ltd. is seeking a project engineer to drive internal and customer projects from engagement through closure in a semiconductor manufacturing environment.

The role involves documenting processes from kick-off to full production, reviewing specifications, and coordinating with cross-functional teams to ensure on-time delivery while controlling costs and quality.

Qualifications

• Minimum 3 years of engineering experience in semiconductor manufacturing.
• Preferably with project management certification.
• Knowledge of bumping, assembly materials interaction with package workmanship and reliability.
• WLCSP bumping process knowledge of 2P2M; DOE/SPC/ FMEA / JMP/ APQP standards.
• Experience with lithography, sputter, etching, plating, descum & ball drop processes.

Responsibilities

• Manages internal and customer projects from engagement until closure through proper planning and timely execution with cross-functional teams.
• Maintains documentation of customer projects from Kick-off to full production.
• Reviews customer specifications and requirements for materials, processes and assembly.
• Initiates team discussions on document gaps and recommends proposals to customers.
• Plans and generates detailed project timelines, tracks progress and resolves issues with stakeholders.
• Ensures customer indices are monitored with regular team meetings and reviews.
• Develops project management skills and adapts to dynamic changes and crises.
• Drives productivity improvements and cost reductions in process integration.
• Collaborates with TPM/Sales/customers on new design wins and handles NPI reliability/quality activities.

Skills

Project management

Semiconductor manufacturing

Bumping & packaging reliability

Education

Degree/Diploma in Electrical/Electronics, Engineering or equivalent

Job description

Responsibilities:

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
• Develop and grow people project management skills, adopting on dynamic changes and crisis management
• Drive for productivity improvement and cost reduction in process integration
• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Requirements:

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent
• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
• Preferably with Project Management Certification
• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC/ FMEA /JMP/ APQP standard
• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred
  We regret that only shortlisted candidates will be notified.