NPI Engineer

UTAC; Singapore; On-site; SGD 75,000 - 105,000; Full time

Job summary

UTAC is seeking a capable Project Manager to lead internal and customer projects from engagement through closure, coordinating cross-functional teams for on-time delivery.

The role requires hands-on experience in semiconductor manufacturing, strong documentation discipline, and the ability to manage complex specifications, risk, and design-for-manufacture activities within NPI and production environments.

Qualifications

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent.
• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry.
• Preferably with Project Management Certification.
• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred.
• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC / FMEA /JMP/ APQP standard.
• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred)

Responsibilities

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
• Develop and grow people project management skills, adopting on dynamic changes and crisis management
• Drive for productivity improvement and cost reduction in process integration
• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Skills

Project management

Cross-functional collaboration

Semiconductor knowledge

Process integration

Education

Degree/Diploma in Electrical/Electronics or Engineering

Job description

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
• Develop and grow people project management skills, adopting on dynamic changes and crisis management
• Drive for productivity improvement and cost reduction in process integration
• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Requirements:

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent
• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
• Preferably with Project Management Certification
• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC / FMEA /JMP/ APQP standard
• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred