Senior Engineer, Assembly

POET Technologies Inc.; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

POET Technologies Inc. seeks a Senior Engineer, Assembly to support research and development in Photonics IC Packaging.

You will perform machine setup, assembly, testing, and troubleshooting for advanced photonics packaging applications, working with cross-functional teams to ensure quality and continuous process improvement. The candidate should have 5+ years in semiconductor assembly, hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders, with CAD tools familiarity.

Qualifications

• Diploma or Bachelor’s in Engineering or related discipline.
• Minimum 5 years of semiconductor industry experience.
• Hands-on experience with die-assembly tools, flip-chip bonders and wire bonders preferred.
• Familiarity with CAD drawing tools advantageous.
• Knowledge of wafer and photonics packaging processes is a plus.

Responsibilities

• Perform machine setup, calibration, testing and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for corrective actions.
• Coordinate with internal teams to manage incoming materials for assembly operations.
• Analyze packaging process performance, including yield, cost, specs, and cycle time.
• Support continuous improvement to enhance manufacturing efficiency and product quality.
• Maintain documentation of assembly procedures, testing results, and engineering activities.

Education

Diploma/Advanced/Higher Diploma (Engineering related)

Bachelor's Degree in Engineering

Tools

Die-assembly tools

Flip-chip bonders

Wire bonders

CAD drawing tools

Job description

We are seeking a highly motivated Senior Engineer, Assembly to support research and development activities in Photonics IC Packaging. The role involves machine setup, assembly, testing, troubleshooting, and process improvement for advanced photonics packaging applications. The successful candidate will work closely with cross-functional teams to ensure efficient assembly operations, quality performance, and continuous process optimization.

Key Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, manufacturing cost, process specifications, and cycle time.
• Support the planning and execution of continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results, and engineering activities.

Requirements

• Diploma, Advanced/Higher/Graduate Diploma, or Bachelor’s Degree in Engineering or a related discipline.
• Minimum 5 years of relevant working experience in the semiconductor industry.
• Hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders is strongly preferred.
• Familiarity with CAD drawing tools is highly advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.