Silicon Photonics Engineer

U3 INFOTECH PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

U3 INFOTECH PTE. LTD. in Singapore seeks a hands-on Silicon Photonics specialist to develop, integrate, and optimize 300mm SiPh platforms for high-speed optical modules and co-packaged optics.

You will translate customer requirements into device specs and define process flows, collaborating across R&D, process, and module engineering teams. The role emphasizes DOE, FMEA, control plans, data-driven analysis, and continuous improvement while coordinating with OSATs and partners for PIC/EIC

Qualifications

• Bachelor's degree in Electronics, Electrical Engineering, Physics, Materials Engineering, or related field.
• Minimum 3 years of hands-on Silicon Photonics (SiPh) R&D, process development, or related field.
• Strong background in SiPh process development and integration.
• PIC design, fabrication, or characterization.
• Optical device design and performance characterization.
• Photonic packaging and integration.
• Semiconductor foundry process development and module-level engineering.
• Familiarity with foundry environments and development workflows.
• Experience with DOE, FMEA, and control plans.
• Strong analytical, troubleshooting, and data interpretation skills.
• Excellent communication and collaboration skills with internal teams, customers, OSATs, and partners.
• Self-motivated and innovative

Responsibilities

• Develop and optimize SiPh platforms for 300mm wafers and related modules.
• Collaborate with R&D, process, and module engineering to define flows.
• Coordinate with OSATs and partners for PIC/EIC characterization and packaging integration.
• Apply DOE, FMEA, and control plans to improve robustness and readiness.
• Perform data-driven analysis, identify deviations, and implement corrective actions.
• Assess technical risks and drive continuous improvement.
• Work with cross-functional teams and external stakeholders to ensure successful development.

Skills

Silicon Photonics

Process development

DOE

FMEA

Data analysis

Cross-functional collaboration

Troubleshooting

Communication

Education

Bachelor's degree in Electronics, Electrical Engineering, Physics, Materials Engineering, or related field

Job description

Develop, integrate, and optimize 300mm Silicon Photonics (SiPh) technology platforms for pluggable optical modules, co-packaged optics (CPO), and photonic interposer applications. Collaborate with R&D, process integration, and module engineering teams to define, develop, and execute SiPh process flows. Translate customer requirements into device specifications, process requirements, and technical solutions through discussions and in-depth technical reviews. Coordinate with external OSATs (Outsourced Semiconductor Assembly and Test providers) and technology partners for Photonic Integrated Circuit (PIC) and Electronic Integrated Circuit (EIC) characterization and packaging integration. Support optical device design, process integration, characterization, and performance optimization. Apply Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and control plan methodologies to improve process robustness, product quality, and manufacturing readiness. Perform data-driven analysis, identify process deviations, investigate root causes, and implement corrective and preventive actions. Assess technical risks and drive continuous improvement throughout technology development, validation, and qualification. Work closely with cross-functional teams and external stakeholders to ensure successful technology development and integration.

Required Qualifications and Skills

• Bachelor's degree in Electronics, Electrical Engineering, Physics, Materials Engineering, or a related technical field.
• Minimum 3 years of hands-on experience in Silicon Photonics (SiPh) R&D, process development, process integration, or a closely related field.
• Strong technical background in one or more of the following: Silicon Photonics process development and integration.
• Photonic Integrated Circuit (PIC) design, fabrication, or characterization.
• Optical device design and performance characterization.
• Photonic packaging and integration.
• Semiconductor foundry process development and module-level engineering.
• Familiarity with semiconductor foundry environments and technology development workflows.
• Working knowledge of DOE, FMEA, control plans, and structured problem-solving methodologies.
• Strong analytical, troubleshooting, and data interpretation skills.
• Excellent communication and collaboration skills, with the ability to engage internal engineering teams, customers, OSATs, and external partners.
• Self-motivated, curious, and committed to innovation, quality, and continuous improvement.

Preferred Qualifications

• Experience with 300mm semiconductor wafer processing and technology development.
• Exposure to silicon photonics applications in high-speed optical communications, data centers, or advanced packaging.
• Knowledge of co-packaged optics (CPO), pluggable optical transceivers, photonic interposers, and PIC/EIC integration.
• Experience supporting process qualification, technology transfer, yield improvement, or manufacturing ramp-up.