Senior Photonics Packaging Engineer

POET Technologies Inc.

Singapore

On-site

SGD 70,000 - 100,000

Full time

14 days+

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Job summary

POET Technologies Inc. seeks a Senior Engineer, Assembly to support research and development in Photonics IC Packaging.

You will perform machine setup, assembly, testing, and troubleshooting for advanced photonics packaging applications, working with cross-functional teams to ensure quality and continuous process improvement. The candidate should have 5+ years in semiconductor assembly, hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders, with CAD tools familiarity.

Qualifications

Diploma or Bachelor’s in Engineering or related discipline.
Minimum 5 years of semiconductor industry experience.
Hands-on experience with die-assembly tools, flip-chip bonders and wire bonders preferred.
Familiarity with CAD drawing tools advantageous.
Knowledge of wafer and photonics packaging processes is a plus.

Responsibilities

Perform machine setup, calibration, testing and mechanical assembly of active devices onto interposers.
Conduct testing on assembled devices and generate detailed test reports and summaries.
Troubleshoot assembly-related issues and document findings for corrective actions.
Coordinate with internal teams to manage incoming materials for assembly operations.
Analyze packaging process performance, including yield, cost, specs, and cycle time.
Support continuous improvement to enhance manufacturing efficiency and product quality.
Maintain documentation of assembly procedures, testing results, and engineering activities.