Senior/ Designer, Packaging

SILICON BOX; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

SILICON BOX is seeking a Packaging Designer in Singapore to lead product and tooling design within advanced packaging environments. The role involves collaborating with internal and external customers to translate requirements into robust PCB and packaging schemes.

You should have a Master’s in Electrical Engineering or a Bachelor’s with substantial experience, plus hands-on experience with fan-in/fan-out processes, wafer bumping, WLCSP, BGA and related tooling.

Qualifications

• Master's degree or higher in electrical engineering or a closely related field.
• Minimum 5-10 years of relevant experience with high-speed packaging.
• Experience with wafer bumping, WLCSP, BGA or fan-out packaging is advantageous.

Responsibilities

• Generate, update and revise electrical routing layouts from internal or external nets.
• Design test vehicles and related PCB layouts.
• Create reticle and stencil designs.
• Document drawing revisions and change records.
• Maintain design guidelines and support supplier handoffs.

Skills

Electrical engineering

PCB design

Risk assessment

Design guidelines

Education

Master's Degree in Electrical Engineering

Bachelor's Degree with 5-10 years experience

Tools

Cadence APD

LinkCAD

CAM350

AutoCAD

GDS

Gerber editors

Job description

The Packaging Designer is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

With reference to internal design guidelines, work with the internal & external customer to:

• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
• Generate test vehicle design and the related PCB design.
• Generate reticle and stencil design.
• Generate other schematics or drawing as requested.
• Review, maintenance and update the design guidelines.
• Manage the conversion of internal design into suppliers’ final design.
• Document all the drawing revisions and change records.
• Any other ad-hoc duties as assigned

Requirements

• Minimum Master’s Degree in Electrical Engineering or similar discipline, or Bachelor's Degree with 5-10 years of relevant experience.
• Good understanding on the design guidelines and familiar in generating risk assessment report based on fan-in/ fan-out process capability.
• Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will be an advantage.
• Hands-on skills on design software tools such as Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors.
• Prior experience with PCB test board design would be advantageous.