Senior/Engineer -Design

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 42,000 - 70,000; Full time

Job summary

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a qualified design engineer to develop and refine packaging for semiconductor products.

The ideal candidate will lead package design from inception to production, ensuring adherence to the latest design standards and customer requirements. The role requires hands-on experience in packaging, CAD proficiency (AutoCAD, Cadence Allegro), and collaboration with Customers, Sales, PE, NPI, R&D, and Suppliers to deliver robust designs.

Qualifications

• Bachelor’s degree or higher in Electrical/Electronic/Mechanical/Materials Engineering.
• Minimum 2 years of hands-on experience in package product design, including tooling design, substrate/assembly, PCB layout design, wafer fabrication, or lead frame manufacturing.
• Fresh graduates are welcome to apply.
• Proficient in package design, including relevant knowledge and skill sets.
• Strong knowledge of CAD software such as AutoCAD, Cadence Allegro Package Design, or similar tools is preferred.

Responsibilities

• Design packages in accordance with customer requirements, ensuring compliance with the latest design standards and requirements
• Maintain and enforce design procedures throughout the entire project development cycle
• Support product development and design new products from inception to production
• Facilitate timely communication with Customers, Sales, PE, NPI, R&D, and Suppliers to deliver robust designs
• Ensure error-free design execution

Skills

Package design

PCB layout design

Mechanical design

Education

Bachelor's degree in Electrical/Electronic/Mechanical/Materials Engineering

Tools

AutoCAD

Cadence Allegro Package Design

Job description

Job Description & Requirements

Key Job Accountabilities

• Design packages in accordance with customer requirements, ensuring compliance with the latest design standards and requirements
• Maintain and enforce design procedures throughout the entire project development cycle
• Support product development and design new products from inception to production
• Facilitate timely communication with Customers, Sales, PE, NPI, R&D, and Suppliers to deliver robust designs
• Ensure error-free design execution

Required Experience and Qualifications

• Bachelor’s degree or higher in Electrical/Electronic/Mechanical/Materials Engineering
• Minimum 2 years of hands-on experience in package product design, including tooling design, substrate/assembly, PCB layout design, wafer fabrication, or lead frame manufacturing
• Fresh graduates are welcome to apply
• Proficient in package design, including relevant knowledge and skill sets
• Strong knowledge of CAD software such as AutoCAD, Cadence Allegro Package Design, or similar tools is preferred