AI-Driven Wafer Bonding Process Engineer

Micron; Singapore; On-site; SGD 120,000 - 200,000; Full time

Job summary

Micron Technology, Inc. is seeking a Bonding Process & Equipment Engineer to drive startup, development, and optimization of wafer-to-wafer bonding processes.

You will collaborate with process integration, equipment engineering, suppliers, and global teams to improve yield, reduce costs, and ensure robust control plans. The role requires deep knowledge of bonding technologies (hybrid, dielectric, TSV-related), DOE/FMEA/SPC methodologies, and strong problem-solving skills to deliver reliable,

Qualifications

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field
• 7+ years of relevant proven experience in semiconductor manufacturing or advanced packaging
• Strong knowledge of semiconductor bonding processes (wafer-to-wafer hybrid bonding, fusion bonding preferred)
• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms
• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred
• Proficiency in data analysis, SPC, and statistical modeling
• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)
• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment
• Excellent communication and collaboration skills across global teams
• 12-inch wafer-to-wafer bonding (from TEL or EVG tool is preferred) and/or 12-inch wafer backside grinding (from Disco tool is preferred)

Responsibilities

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)
• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets
• Drive process capability improvement (Cpk) and defect reduction
• Lead yield enhancement initiatives by analyzing process, tool, and material interactions
• Perform systematic root cause analysis using DOE, FMEA, 8D, SPC, and fault isolation techniques
• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions
• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools
• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements
• Evaluate and introduce new materials/spares/parts for performance improvement
• Support technology transfer and ramp-up across global sites
• Align process baseline (POR) and ensure consistency through documentation and control plans
• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility
• Diagnose and resolve manufacturing line issues impacting bonding yield and performance
• Analyze process excursions and implement containment and recovery actions
• Drive continuous improvement for cycle time, tool availability, and cost efficiency
• Lead new process and baseline qualifications
• Develop control plans, SPC strategies, and inline monitoring systems
• Establish risk mitigation frameworks and ensure compliance with manufacturing standards
• Partner with suppliers for technology development, process improvement, and cost optimization
• Audit material and equipment suppliers to ensure quality and reliability targets are met
• Collaborate with global teams and partners to drive alignment and execution
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements

Skills

Data analysis

SPC

DOE

Problem solving

Cross-functional collaboration

Communication

Knowledge of wafer bonding processes

Education

Bachelor’s/Master’s/Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering

Tools

TEL bonding tools

EVG tooling

Disco wafer grinder

Wafer bonding equipment

Job description

Micron Technology, Inc. is seeking a Bonding Process & Equipment Engineer to drive startup, development, and optimization of wafer-to-wafer bonding processes.

You will collaborate with process integration, equipment engineering, suppliers, and global teams to improve yield, reduce costs, and ensure robust control plans. The role requires deep knowledge of bonding technologies (hybrid, dielectric, TSV-related), DOE/FMEA/SPC methodologies, and strong problem-solving skills to deliver reliable,