Advanced Packaging Application Engineer - Senior role / Semiconductor Manufacturing

the supreme hr advisory pte. ltd.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

the supreme hr advisory pte. ltd. is recruiting for an Advanced Packaging Applications Engineer in Singapore. You will understand customer roadmaps, translate requirements into equipment specs, and support technical discussions and demonstrations.

We seek 5+ years in semiconductor packaging, with hands-on experience in TCB, flip chip, 2.5D/3D packaging, and related qualifications. Knowledge of HBM, CoWoS, CoPoS is advantageous. Location: Sembawang, Singapore; salary SGD 8,000–10,000 per month.

Qualifications

• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in one or more of: TCB, advanced packaging, flip chip, NPI, process qualification, equipment qualification, manufacturing engineering, customer process development.
• Experience supporting advanced package technologies such as HBM, CoWoS, CoPoS, chiplets, 2.5D/3D packaging, large die packaging.
• Knowledge of TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers is an advantage.
• Strong understanding of packaging technologies and semiconductor manufacturing processes.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving TCB, 2.5D/3D packaging, and related advanced packaging tech.
• Evaluate and optimize bond force, temperature profiles, process windows, and alignment accuracy.

Skills

Semiconductor packaging

Thermo Compression Bonding

Flip Chip Assembly

HBM Packaging

CoWoS

CoPoS

2.5D Packaging

3D Packaging

Chiplets

Large Die Packaging

Process Qualification

Equipment Qualification

DOE

Yield Improvement

Reliability Testing

Alignment Accuracy

Education

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering disciplines

Job description

WhatsApp: [phone] (Kyler)

Email: [e-mail]

Location: Sembawang

Working Days: 5 Day A Week

Working Hours : 9:00am - 6:00pm

Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

Provide technical guidance throughout equipment development.

Machine Qualification

Serve as the internal customer during equipment development.

Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

Support future product strategy and technology roadmap planning.

Requirements

Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

Minimum 5 years experience in semiconductor advanced packaging.

Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.