Senior Advanced Packaging Applications Engineer

the supreme hr advisory pte. ltd.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

the supreme hr advisory pte. ltd. is recruiting for an Advanced Packaging Applications Engineer in Singapore. You will understand customer roadmaps, translate requirements into equipment specs, and support technical discussions and demonstrations.

We seek 5+ years in semiconductor packaging, with hands-on experience in TCB, flip chip, 2.5D/3D packaging, and related qualifications. Knowledge of HBM, CoWoS, CoPoS is advantageous. Location: Sembawang, Singapore; salary SGD 8,000–10,000 per month.

Qualifications

• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in one or more of: TCB, advanced packaging, flip chip, NPI, process qualification, equipment qualification, manufacturing engineering, customer process development.
• Experience supporting advanced package technologies such as HBM, CoWoS, CoPoS, chiplets, 2.5D/3D packaging, large die packaging.
• Knowledge of TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers is an advantage.
• Strong understanding of packaging technologies and semiconductor manufacturing processes.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving TCB, 2.5D/3D packaging, and related advanced packaging tech.
• Evaluate and optimize bond force, temperature profiles, process windows, and alignment accuracy.

Skills

Semiconductor packaging

Thermo Compression Bonding

Flip Chip Assembly

HBM Packaging

CoWoS

CoPoS

2.5D Packaging

3D Packaging

Chiplets

Large Die Packaging

Process Qualification

Equipment Qualification

DOE

Yield Improvement

Reliability Testing

Alignment Accuracy

Education

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering disciplines

Job description

the supreme hr advisory pte. ltd. is recruiting for an Advanced Packaging Applications Engineer in Singapore. You will understand customer roadmaps, translate requirements into equipment specs, and support technical discussions and demonstrations.

We seek 5+ years in semiconductor packaging, with hands-on experience in TCB, flip chip, 2.5D/3D packaging, and related qualifications. Knowledge of HBM, CoWoS, CoPoS is advantageous. Location: Sembawang, Singapore; salary SGD 8,000–10,000 per month.