Senior Packaging Engineer - TCB & Advanced Packaging

The Supreme HR Advisory Pte Ltd; Singapore; On-site; SGD 100,000 - 112,000; Full time

Job summary

The Supreme HR Advisory is seeking a Senior Advanced Packaging Application Engineer focused on Thermo Compression Bonding (TCB) to support semiconductor customers from Admiralty, Singapore. You will translate complex packaging requirements into actionable process specifications and work across multi-disciplinary teams.

Applicants should have hands-on TCB and Flip Chip experience, and a strong background in HBM/CoWoS/2.5D/3D packaging, aiming to drive process improvements and qualification

Qualifications

• Bachelor’s or Master’s Degree in related engineering fields.
• 5–15 years of semiconductor packaging experience.
• Hands-on TCB and Flip Chip experience.
• HBM/CoWoS/2.5D/3D packaging experience.
• Experience in fluxless or N2 bonding environments is a plus.

Responsibilities

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
• Support technical sales activities and customer discussions.
• Benchmark competitor equipment and identify technology gaps.
• Translate customer requirements into internal equipment specifications.
• Develop and optimize TCB process parameters on TCB equipment.
• Support advanced packaging applications including HBM, CoWoS, 2.5D and 3D packaging.
• Troubleshoot bonding issues and conduct DOE and process characterization.
• Lead machine qualification, FAT and SAT activities.
• Act as the internal customer during machine development.
• Support customer buyoff and onsite qualification activities.

Skills

Semiconductor packaging

Thermo Compression Bonding

Flip Chip

HBM/CoWoS/2.5D/3D packaging

DOE / statistical analysis

Education

Bachelor’s or Master’s Degree in related engineering fields

Job description

The Supreme HR Advisory is seeking a Senior Advanced Packaging Application Engineer focused on Thermo Compression Bonding (TCB) to support semiconductor customers from Admiralty, Singapore. You will translate complex packaging requirements into actionable process specifications and work across multi-disciplinary teams.

Applicants should have hands-on TCB and Flip Chip experience, and a strong background in HBM/CoWoS/2.5D/3D packaging, aiming to drive process improvements and qualification