Senior Advanced Packaging Characterization Engineer (APTD)

Micron; Singapore; On-site; SGD 120,000 - 170,000; Full time

Job summary

Micron Technology, Inc. is seeking an Advanced Packaging Characterization Engineer within the Advanced Packaging Technology Development team in Singapore.

You will lead characterization and failure analysis for development test vehicles, qualifications, and customer returns, acting as a SME for advanced packaging methodologies and ensuring root-cause fixes are implemented across cross-functional groups. The role requires deep technical skills in semiconductor analysis, strong communication, and

Qualifications

• PhD with ≥5 years, or Master's with ≥7 years, or Bachelor's with ≥10 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Semiconductor industry experience, preferably in product, packaging or test engineering.

Responsibilities

• Characterize electrical and PFA performance for advanced packaging.
• Perform electrical fault analysis to pinpoint hotspots on advanced packages.
• Cross-section hotspots using Plasma FIB; die-stacked characterization.
• Understand PFA techniques and back-end test flows; document failure analysis methods.

Skills

Failure analysis

Cross-functional

Analytical tools

Communication skills

Education

Bachelor/Master/PhD in relevant field

Tools

SEM

EDX

FIB

TEM

AFM

FTIR

XPS

CSAM

Ion Milling

Decapsulation

Job description

Micron Technology, Inc. is seeking an Advanced Packaging Characterization Engineer within the Advanced Packaging Technology Development team in Singapore.

You will lead characterization and failure analysis for development test vehicles, qualifications, and customer returns, acting as a SME for advanced packaging methodologies and ensuring root-cause fixes are implemented across cross-functional groups. The role requires deep technical skills in semiconductor analysis, strong communication, and