Senior Advanced Packaging Characterization Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development to lead characterization, failure analysis, and process understanding for development test vehicles and new products.

You will apply cutting-edge FA techniques, collaborate across process, reliability, and product teams, and mentor colleagues while contributing to continuous improvement and technology development in a fast-paced environment.

Qualifications

• PhD with ≥5 years, or Master's degree with ≥7 years, or Bachelor's degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Semiconductor industry experience in product, packaging or test engineering and complex products.

Responsibilities

• Conduct Electrical and PFA Characterization
• Perform electrical fault analysis to pin-point hotspots on advanced packages
• Perform precision cross-section on hotspot location using Plasma FIB
• Perform die-stacked characterization using a combination of sample prep tools including Plasma FIB
• Understand the various PFA techniques available for de-processing failures
• Understand assembly and test process for advanced packaging technology
• Establish best known methods for de-processing of advanced packaging
• Provide Data Analysis
• Communicate with Internal/External Groups
• Document failure analysis techniques used to isolate failure for other groups
• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
• Provide Technical Expertise
• Conduct TMO training and FA certification
• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network
• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap
• Maintain Equipment
• Coordinate calibrations (external to Micron)
• Procure parts as needed
• Coordinate host vendors to support equipment repair
• Manage Laboratory
• uphold Micron safety standards and compliance

Skills

Analytical skills

Communication & leadership

Independent work

Cross-functional collaboration

Education

PhD +5 years / MSc +7 yrs / Bachelors +10 yrs in EE / materials / physics

Tools

SEM

EDX

FIB

TEM

AFM

FTIR

XPS

X-ray

CSAM

Ion Milling

delayering

decapsulation

Job description

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development to lead characterization, failure analysis, and process understanding for development test vehicles and new products.

You will apply cutting-edge FA techniques, collaborate across process, reliability, and product teams, and mentor colleagues while contributing to continuous improvement and technology development in a fast-paced environment.