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Micron Technology, Inc. is seeking an Advanced Packaging Characterization Engineer within APDT to support development test vehicles, qualifications, customer returns, and new product introductions.
You will lead advanced packaging characterization techniques, classify failures, and contribute to root-cause fixes across product engineering and processing groups. Ideal candidates have 4+ years in semiconductor failure analysis, hands-on experience with SEM/EDX/FIB/TEM and related tools, and strong
Micron Technology, Inc. is seeking an Advanced Packaging Characterization Engineer within APDT to support development test vehicles, qualifications, customer returns, and new product introductions.
You will lead advanced packaging characterization techniques, classify failures, and contribute to root-cause fixes across product engineering and processing groups. Ideal candidates have 4+ years in semiconductor failure analysis, hands-on experience with SEM/EDX/FIB/TEM and related tools, and strong