Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw

STATS CHIPPAC MANAGEMENT PTE. LTD.

Singapore

On-site

SGD 42,000 - 64,000

Full time

2 days ago
Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a dedicated process engineering professional to support Backend2 operations, including wafer backgrind, laser mark, and wafer saw, ensuring smooth production and quality.

You will collaborate with engineers and supervisors, develop recipes, investigate issues, and help optimize cycle time while adapting to a 12-hour rotating shift in a fast-paced environment.

Qualifications

  • Must have Diploma or Degree in Electrical & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent.
  • 2 years of relevant experience in EWLB or WLCSP preferred.
  • Ability to work in a fast-paced environment and on a 12-hour rotating shift.

Responsibilities

  • Perform production line sustaining to ensure all processes run without quality issues.
  • Follow up on process improvement projects assigned by Process Engineer.
  • Characterize new devices and create recipes in the machine.
  • Respond promptly to investigate and analyze products with problems.
  • Collaborate with line supervisor to clear real-time bottlenecks affecting cycle time and quality.
  • Support with other Associate Engineers to resolve equipment downtime.
  • Communicate with Engineers and external vendors to resolve problems and provide training to junior staff.

Skills

Process engineering
Manufacturing troubleshooting
Cross-functional collaboration

Education

Electrical & Electronic Engineering
Mechanical Engineering

Job description

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

Provide process engineering support on the following Backend2 process: (1) Wafer Backgrind (2) Laser Mark (3) Wafer Saw and process operational issues as per guidance of Process Engineer.

Key responsibilities

  • Perform production line sustaining to ensure all the processes are running without any quality issue

  • Follow up the process improvement projects which assigned by Process Engineer

  • Characterize new devices and create recipes in the machine.

  • Immediate response to investigate and analyze products with problem

  • Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality

  • Cross support with other Associate Engineer to clear equipment downtime

  • Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists or Manufacturing Specialists

What we're looking for

  • Diploma or Degree in Electric & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent

  • 2 years of relevant experience in EWLB or WLCSP are preferred

  • Positive mindset with ability to adapt to fast-paced working environment

  • Ability to work on 12 hours rotating shift

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw
Senior / Associate Process Engineer - Wafer Backgrind, Laser Mark, Wafer Saw

stats chippac pte. ltd. • Singapore

On-site
SGD 42,000 - 66,000
Senior Process Engineer: Wafer Backgrind, Laser Mark & Saw
Senior Process Engineer: Wafer Backgrind, Laser Mark & Saw

stats chippac pte. ltd. • Singapore

On-site
SGD 42,000 - 66,000
Process Engineer – Wafer Backgrind, Laser Mark & Saw
Process Engineer – Wafer Backgrind, Laser Mark & Saw

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

On-site
SGD 42,000 - 64,000
Senior/Associate Process Engineer - Wet & Plate
Senior/Associate Process Engineer - Wet & Plate

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

On-site
SGD 70,000 - 110,000
Engineer - Test Process (WLCSP)
Engineer - Test Process (WLCSP)

ASE SINGAPORE PTE. LTD. • Singapore

On-site
SGD 70,000 - 100,000
Senior Associate Process Engineer - Package pick & place process
Senior Associate Process Engineer - Package pick & place process

stats chippac pte. ltd. • Singapore

On-site
SGD 42,000 - 66,000
Senior Associate Process Engineer - Package pick & place process
Senior Associate Process Engineer - Package pick & place process

STATS CHIPPAC MANAGEMENT PTE. LTD. • Singapore

On-site
SGD 42,000 - 66,000
Snr / Associate Equipment Engineer - Pre-assembly, Reconstitution
Snr / Associate Equipment Engineer - Pre-assembly, Reconstitution

STATS CHIPPAC PTE. LTD. • Singapore

On-site
SGD 42,000 - 66,000
Engineer – Equipment, Wafer Prep Engineering
Engineer – Equipment, Wafer Prep Engineering

UTAC • Singapore

On-site
SGD 42,000 - 68,000
Engineer - Test Process (WLCSP)
Engineer - Test Process (WLCSP)

ASE Singapore Pte Ltd • Singapore

On-site
SGD 60,000 - 90,000