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STATS ChipPAC in Singapore is seeking a process engineering support professional for Backend2 processes: Wafer Backgrind, Laser Mark, Wafer Saw. Responsibilities include sustaining production lines, following up improvements, and characterizing new devices with device recipes.
The role requires a diploma/degree in engineering and 2 years EWLB/WLCSP experience. The position involves 12-hour rotating shifts, teamwork with line supervisors, and collaboration with engineers and vendors to resolve
STATS ChipPAC in Singapore is seeking a process engineering support professional for Backend2 processes: Wafer Backgrind, Laser Mark, Wafer Saw. Responsibilities include sustaining production lines, following up improvements, and characterizing new devices with device recipes.
The role requires a diploma/degree in engineering and 2 years EWLB/WLCSP experience. The position involves 12-hour rotating shifts, teamwork with line supervisors, and collaboration with engineers and vendors to resolve