Process Engineer - Back Grind & Saw

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 45,000 - 65,000; Full time

Job summary

STATS ChipPAC PTE. LTD. is seeking a qual/engineering support professional to drive New Product Introduction and engineering builds from development to high-volume production. You will collaborate across Operations to ensure builds meet specifications and support process improvements.

The role requires hands-on knowledge of pre-assembly processes, SPC methods, and problem-solving discipline. Flexibility to work beyond normal hours may be needed to meet customer and project milestones.

Qualifications

• Knowledge of Backgrind, Laser Groove and Wafer Saw processes.
• Typically requires several years in Pre-Assembly manufacturing.
• Strong problem solving and SPC understanding.

Responsibilities

• Coordinate with Operations to ensure Engineering Builds meet requirements.
• Perform customer evaluations and DOE; provide improvement recommendations.
• Ensure smooth transition of new products from Engineering to High Volume Manufacturing.
• Provide corrective actions and improvement plans for issues during Engineering & Qualification builds.

Skills

Communication skills

Overtime willingness

Pre-assembly exp

Tools

Backgrind

Laser Groove

Wafer Saw

Job description

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

Support qualification & engineering builds for pre-assembly and customer builds from engineering to high volume production. All aspects of this job are NPI and Qual Engineering plant wide, affecting operations.

Key responsibilities

• Coordinates with Operations to ensure that Engineering Builds are processed per requirement.
• Perform customer evaluations and DOE & provide recommendation for improvements if necessary.
• Ensures smooth transition of new products from Engineering Mode to High Volume Manufacturing.
• Provide corrective actions & improvement plans for all issues observed during Engineering & Qualification builds.

What we're looking for

• In-depth knowledge of Backgrind, Laser Groove & Wafer Saw process.
• Preferably 3 years experience in Pre-Assembly process.
• Good knowledge in SPC & Problem Solving Methodology.
• Good communication skills.
• Able to work beyond normal working hours if needed.