Process Engineer – Wafer Backgrind, Laser Mark & Saw

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 42,000 - 64,000; Full time

Job summary

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a dedicated process engineering professional to support Backend2 operations, including wafer backgrind, laser mark, and wafer saw, ensuring smooth production and quality.

You will collaborate with engineers and supervisors, develop recipes, investigate issues, and help optimize cycle time while adapting to a 12-hour rotating shift in a fast-paced environment.

Qualifications

• Must have Diploma or Degree in Electrical & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent.
• 2 years of relevant experience in EWLB or WLCSP preferred.
• Ability to work in a fast-paced environment and on a 12-hour rotating shift.

Responsibilities

• Perform production line sustaining to ensure all processes run without quality issues.
• Follow up on process improvement projects assigned by Process Engineer.
• Characterize new devices and create recipes in the machine.
• Respond promptly to investigate and analyze products with problems.
• Collaborate with line supervisor to clear real-time bottlenecks affecting cycle time and quality.
• Support with other Associate Engineers to resolve equipment downtime.
• Communicate with Engineers and external vendors to resolve problems and provide training to junior staff.

Skills

Process engineering

Manufacturing troubleshooting

Cross-functional collaboration

Education

Electrical & Electronic Engineering

Mechanical Engineering

Job description

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a dedicated process engineering professional to support Backend2 operations, including wafer backgrind, laser mark, and wafer saw, ensuring smooth production and quality.

You will collaborate with engineers and supervisors, develop recipes, investigate issues, and help optimize cycle time while adapting to a 12-hour rotating shift in a fast-paced environment.