NPI Process Engineer: Backgrind, Laser Groove & Wafer Saw

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 45,000 - 65,000; Full time

Job summary

STATS ChipPAC PTE. LTD. is seeking a qual/engineering support professional to drive New Product Introduction and engineering builds from development to high-volume production. You will collaborate across Operations to ensure builds meet specifications and support process improvements.

The role requires hands-on knowledge of pre-assembly processes, SPC methods, and problem-solving discipline. Flexibility to work beyond normal hours may be needed to meet customer and project milestones.

Qualifications

• Knowledge of Backgrind, Laser Groove and Wafer Saw processes.
• Typically requires several years in Pre-Assembly manufacturing.
• Strong problem solving and SPC understanding.

Responsibilities

• Coordinate with Operations to ensure Engineering Builds meet requirements.
• Perform customer evaluations and DOE; provide improvement recommendations.
• Ensure smooth transition of new products from Engineering to High Volume Manufacturing.
• Provide corrective actions and improvement plans for issues during Engineering & Qualification builds.

Skills

Communication skills

Overtime willingness

Pre-assembly exp

Tools

Backgrind

Laser Groove

Wafer Saw

Job description

STATS ChipPAC PTE. LTD. is seeking a qual/engineering support professional to drive New Product Introduction and engineering builds from development to high-volume production. You will collaborate across Operations to ensure builds meet specifications and support process improvements.

The role requires hands-on knowledge of pre-assembly processes, SPC methods, and problem-solving discipline. Flexibility to work beyond normal hours may be needed to meet customer and project milestones.