Wire Bond Equipment Engineer (2+ yrs, Day/Night Shift)

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 42,000 - 66,000; Full time

Job summary

STATS ChipPAC PTE. LTD. in Singapore is seeking an Associate Engineer to support wire bond equipment setup, maintenance, troubleshooting and repair in a semiconductor manufacturing environment.

Key responsibilities include machine setup and conversion, downtime minimization, preventive maintenance, and root cause analysis, with a requirement for a 12-hour rotating shift including day and night coverage.

Qualifications

• Diploma in Electrical/ Electronics/ Mechatronics or related field.
• Minimum 2 years hands-on experience with wire bond equipment maintenance and troubleshooting.
• Experience with KNS Maxum, iConn, or Rapid Bonder preferred.

Responsibilities

• Perform machine setup, qualification, and conversion for wire bond equipment.
• Troubleshoot and repair equipment-related issues to minimize production downtime.
• Conduct preventive and corrective maintenance activities.
• Monitor equipment performance and implement improvement actions.
• Support production during machine breakdowns and urgent technical issues.
• Perform root cause analysis and corrective actions.
• Maintain equipment documentation and spare parts records.

Skills

Wire bond equipment

Troubleshooting

Maintenance

Root cause analysis

Education

Diploma in Electrical/ Electronics/ Mechatronics

Tools

KNS Maxum

iConn

Rapid Bonder

Job description

STATS ChipPAC PTE. LTD. in Singapore is seeking an Associate Engineer to support wire bond equipment setup, maintenance, troubleshooting and repair in a semiconductor manufacturing environment.

Key responsibilities include machine setup and conversion, downtime minimization, preventive maintenance, and root cause analysis, with a requirement for a 12-hour rotating shift including day and night coverage.