Field Application Engineer - Semiconductor Equipment

TALENT RECRUITMENT PTE. LTD.; Singapore; On-site; SGD 45,000 - 67,000; Full time

Job summary

TALENT RECRUITMENT PTE. LTD. is seeking an Application Engineer in Woodlands, Singapore to develop and optimize die bonding processes and support customers on-site.

You will set up, calibrate and troubleshoot production equipment and work with cross-functional teams to resolve technical issues. The role requires hands-on experience with semiconductor equipment, die bonding, wafer handling and robust problem-solving skills.

Qualifications

• Diploma or degree in mechanical/mechatronics/electrical/electronics/materials/manufacturing/automation or related field.
• Minimum 2 years of relevant experience in semiconductor equipment, automation or precision manufacturing.
• Hands-on experience with die bonding/die attach, wafer handling and related equipment.

Responsibilities

• Develop, optimize and qualify die bonding processes and equipment.
• Set up, calibrate and troubleshoot machines; adjust process parameters and recipes.
• Conduct root cause analysis and implement corrective actions for equipment/process issues.
• Support process improvement, yield enhancement and cycle-time optimization.
• Collaborate with R&D, Engineering, Manufacturing and Quality teams on technical issues.
• Provide installation, application and technical support at customer sites.
• Conduct customer training and support Field Application Engineers.
• Gather customer feedback and support product/process improvement.

Skills

Die bonding

Die attach

Automation

Precision manufacturing

Data analysis

DOE/ SPC / Cp/Cpk / GR&R

RCA / root-cause analysis

Troubleshooting

Travel readiness

Education

Diploma or Degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering

Tools

Vision systems

Servo systems

Sensors

Vacuum

Pneumatics

Precision positioning systems

Job description

TALENT RECRUITMENT PTE. LTD. is seeking an Application Engineer in Woodlands, Singapore to develop and optimize die bonding processes and support customers on-site.

You will set up, calibrate and troubleshoot production equipment and work with cross-functional teams to resolve technical issues. The role requires hands-on experience with semiconductor equipment, die bonding, wafer handling and robust problem-solving skills.