Senior Scientist, Advanced Wafer-to-wafer Hybrid Bonding, APM, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore invites applications for a Research Scientist – Temporary Wafer Bonding & Debonding (R&D). The role focuses on developing TBDB technologies for 3D ICs and advanced semiconductor packaging.

The successful candidate will design DOE studies, optimize processes, collaborate across disciplines, and contribute to patents and publications. This position is based in Singapore and involves close collaboration with industry and academic

Qualifications

• PhD in a relevant field with strong research background.
• Hands-on semiconductor process development in a cleanroom.
• Experience in TBDB, wafer bonding or related modules preferred; fresh PhDs welcome.
• Strong analytical and problem-solving skills with DOE and data analysis experience.
• Self-motivated team player with excellent communication and teamwork skills.

Responsibilities

• Develop and optimize TBDB processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through root‑cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust solutions.
• Collaborate with vendors to evaluate and qualify bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document results.
• Contribute to technology innovation through patents, publications, and external collaborations.

Skills

Semiconductor process development

Temporary bonding

Wafer bonding

Statistical data analysis

DOE methods

Analytical problem solving

Communication skills

Teamwork

Education

PhD in Materials Science / Mechanical Engineering / Chemical Engineering / Electrical Engineering / Physics / chemistry

Job description

Research Scientist – Temporary Wafer Bonding & Debonding (R&D)

Enable the Future of Advanced Semiconductor Packaging

We are seeking a passionate and innovative Research Scientist to join our multidisciplinary R&D team to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. This is an exciting opportunity to work on enabling technologies for 3D ICs, chiplets, heterogeneous integration, and wafer-level packaging, transforming research ideas into robust manufacturing solutions.

Key Responsibilities

• Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through systematic root‑cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust process solutions.
• Collaborate with vendor to evaluate and qualify new bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.

Qualifications

• Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, chemistry, or a related discipline.
• Hands‑on experience in semiconductor process development within a cleanroom environment.
• Experience in temporary bonding, wafer bonding, advanced packaging, thin‑wafer processing, semiconductor assembly, or related process modules is preferred. Fresh Ph.D. graduates with strong research interest are welcome to apply.
• Strong analytical and problem‑solving skills with experience in DOE and statistical data analysis.
• Self‑motivated team player with excellent communication and teamwork skills with a passion for developing innovative semiconductor technologies.