R & D Engineer – Underfill/Cure

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

STATS ChipPAC is seeking an engineer to design, qualify, and optimize advanced underfill processes for CoWoS packaging, ensuring high-density, reliable, and scalable technology delivery across the roadmap.

You will drive process development, material evaluation, void control, failure analysis, and collaboration with customers, leading projects and transferring technology.

Qualifications

• Bachelor's degree or higher in engineering or science as specified in the posting.
• Experience in R&D or mass production of underfill processes, dispensing, or encapsulation.
• Strong DoE, FA, and data reporting skills.
• Experience driving customer development programs and managing requirements.
• Understanding of advanced semiconductor packaging, underfill dynamics, and stress control.
• Ability to prepare technical documents and deliver presentations.

Responsibilities

• Advanced Underfill Process development for CoWoS PKG product family and CPO.
• Dispensing & Material Evaluation / Qualification.
• Void & Fillet Control.
• Failure Analysis & Reliability Enhancement.
• Customer Development & Technology Transfer.
• Lead assigned projects.
• Yield Improvement & Yield FA.

Skills

Underfill processes

DoE

Failure Analysis

Technical reporting

Technical writing

Customer development

Dispensing equipment

Encapsulation technology

Education

Bachelor's degree in engineering or science

Tools

Dispenser

Cure oven

Epoxy/resin materials

Reliability characterization tools

Job description

About the role

To design, qualify, and optimize advanced underfill processes (e.g., CUF, MUF, NCF/NCP) that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.

Key responsibilities

• Advanced Underfill Process development for CoWoS PKG product family and CPO




• Dispensing & Material Evaluation / Qualification




• Void & Fillet Control




• Failure Analysis & Reliability Enhancement




• Customer Development & Technology Transfer




• Lead assigned projects




• Yield Improvement & Yield Failure Analysis (FA)

About you

• Bachelor's degree or higher in engineering or science (e.g., Material Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials, etc.)




• R&D or mass production experience of at least three years in Underfill processes (e.g., CUF, MUF, NCF/NCP), dispensing, or encapsulation technology




• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements




• Fundamental understanding of advanced semiconductor packaging processes, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control




• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting




• Ability to prepare technical documents and deliver presentations to internal and external stakeholders




• Proficiency in reading and writing technical documents in English




• Basic knowledge of underfill equipment (dispenser, cure oven), epoxy/resin materials, and inspection/reliability characterization tools