Scientist, Optical Interconnect Integration, IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

A*STAR RESEARCH ENTITIES in Singapore seeks a researcher to advance optical interconnect integration through 2.5D/3D packaging for Co-Packaged Optics and heterogeneous platforms. You will work on test vehicles, alignments, and wafer-level packaging processes with internal and external teams.

You will perform optical simulations, characterize fabricated structures, and help shape architectures for GPU–GPU and multi-chiplet systems. Strong collaboration and documentation skills are essential.

Qualifications

• Strong understanding of optical interconnect integration and advanced packaging concepts for CPO and heterogeneous platforms.
• Knowledge of optical coupling mechanisms, loss sources, alignment tolerances, and package-induced variations.
• Familiarity with photonic integration platforms such as SiPh, InP, and TFLN, including edge- and grating-coupler interfaces.
• Understanding of passive and active optical alignment approaches for fiber-array and chip-level coupling.
• Knowledge of wafer- and package-level fabrication processes (lithography, etching, thinning, bonding, molding, dicing).
• Familiarity with optical simulation and analysis tools for evaluating coupling efficiency and interface performance.

Responsibilities

• Support optical interconnect integration using 2.5D and 3D advanced packaging approaches.
• Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners.
• Develop optical interconnect solutions for Co-Packaged Optics and heterogeneous platforms.
• Perform optical simulation and analysis to assess coupling loss and alignment tolerance.
• Design and evaluate optical coupling structures (edge- and grating-couplers, lens-assisted, fiber-array interfaces).
• Develop passive fiber alignment concepts and detachable low-loss connector schemes.
• Contribute to interconnect architectures for multi-chiplet system-level packaging.
• Perform optical and electro-optical characterization of fabricated structures and testing setups.

Skills

Optical interconnect

Advanced packaging

SiPh integration

InP platforms

TFLN familiarity

Edge/grating couplers

Fiber-array coupling

Tools

Optical simulation tools

Job description

Job Description

Job Responsibilities:

• Support optical interconnect integration using 2.5D and 3D advanced packaging approaches.
• Understand and generate package design layouts, process-flow concepts, test vehicle plans, and validation strategies.
• Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners.
• Develop advanced package-level and wafer-level optical interconnect solutions for Co-Packaged Optics (CPO) and heterogeneous integration platforms.
• Perform optical simulation and analysis to assess coupling loss, alignment tolerance, package-stack effects, and interface-related optical performance.
• Design and evaluate optical coupling structures, including grating-coupler, edge-coupler, lens-assisted, and fiber-array-based interfaces.
• Develop passive fiber alignment concepts and detachable low-loss optical connector schemes for high-density optical I/O integration.
• Contribute to optical interconnect architectures for GPU–GPU, GPU–memory, and multi-chiplet system-level packaging applications.
• Perform optical and electro-optical characterization of fabricated structures, including optical loss, coupling efficiency, high-speed modulation response, eye-diagram, and link-level performance evaluation.
• Support package-level electro-optical testing of optical interconnect test vehicles using relevant optical, RF, and high-speed measurement setups.
• Propose new concepts to improve optical coupling efficiency, alignment tolerance, manufacturability, and testability of next‑generation CPO platforms.

Requirements

• Strong understanding of optical interconnect integration and advanced packaging concepts for Co-Packaged Optics (CPO) and heterogeneous integration platforms.
• Knowledge of optical coupling mechanisms, optical loss sources, alignment tolerances, and package‑induced optical performance variations.
• Familiarity with photonic integration platforms such as Silicon Photonics (SiPh), Indium Phosphide (InP), and Thin‑Film Lithium Niobate (TFLN), including edge‑coupler and grating‑coupler interfaces.
• Understanding of passive and active optical alignment approaches for fiber‑array and chip‑level optical coupling structures.
• Knowledge of wafer‑level and package‑level fabrication processes, including lithography, plasma etching, wafer thinning, bonding, molding, and dicing processes.
• Familiarity with optical simulation and analysis tools for evaluating coupling efficiency, alignment sensitivity, and optical interface performance.
• Understanding of optical and electro‑optical characterization techniques, including optical loss measurement, high‑speed modulation testing, eye‑diagram evaluation, and package‑level optical testing.
• Familiarity with microscope‑based inspection, metrology, and laboratory characterization.
• Ability to support process integration activities, and collaboration with internal teams and external partners.
• Strong analytical, problem‑solving, communication, teamwork, and technical documentation skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.