Senior Optical Interconnect Scientist, Co-Packaged Optics

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

A*STAR RESEARCH ENTITIES is seeking a highly skilled engineer to develop package-level optical interconnects for Co Packaged Optics (CPO) platforms. You will interface with various optical coupling schemes and design for wafer-scale integration, while simulating and optimizing bonding interfaces and packaging structures.

You will work with silicon and other materials for lenses, estimate losses across grating and edge couplers, and contribute to multi-chiplet heterogeneous integration.

Qualifications

• MS or PhD in Engineering Physics or related field with 5+ years of experience.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber to chip coupling.
• Knowledge of wafer-level processes and photonic packaging platforms.
• Excellent communication and teamwork skills.

Responsibilities

• Develop package level optical interconnects for Co Packaged Optics (CPO) platforms interfacing with various optical coupling schemes.
• Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
• Design silicon and alternative material lenses for optical IOs in wafer-scale integration.
• Estimate optical losses between grating couplers, edge couplers and fiber interfaces through lens structures.
• Design package level and wafer level optical interconnects between GPU to GPU and GPU to memory for multi-chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high-density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to advance the state of the art in optical interconnects and testing.

Skills

Optical interconnect modeling

Passive alignment techniques

Optical loss mechanisms

Wafer-level processes

Photonic packaging platforms

Edge/Grating couplers

Microscope-based alignment metrology

Optical testing and metrology

Education

MS/PhD in Engineering Physics or related field

Job description

A*STAR RESEARCH ENTITIES is seeking a highly skilled engineer to develop package-level optical interconnects for Co Packaged Optics (CPO) platforms. You will interface with various optical coupling schemes and design for wafer-scale integration, while simulating and optimizing bonding interfaces and packaging structures.

You will work with silicon and other materials for lenses, estimate losses across grating and edge couplers, and contribute to multi-chiplet heterogeneous integration.