Senior Scientist I, Co-Packaged Optics, Adv Pckg, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research is seeking a specialist in optical interconnects to advance package-level and wafer-level integration for multi-chiplet systems.

You will simulate hybrid bonding effects, design lenses for wafer-scale optical IOs, and develop alignment and metrology workflows using SiPh, InP, and TFLN platforms. This role emphasizes hands-on modeling, experimental validation, and collaboration across teams.

Qualifications

• MS or PhD in Engineering Physics or a related field.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling.
• Familiarity with wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
• Experience with photonic packaging platforms (SiPh, InP, and TFLN) and coupling interfaces.

Responsibilities

• Simulate the impact of hybrid bonding interfaces, package stacks, and other packaging elements on optical signal transmission.
• Design silicon and alternative material lenses for optical IOs in wafer-scale integration.
• Estimate optical losses between grating couplers, edge couplers, and fiber interfaces through lens structures.
• Design package-level and wafer-level optical interconnects between GPUs to GPUs and GPUs to memory for multi-chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high-density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to advance the state of the art in optical interconnects and testing.

Skills

Optical interconnect modeling

Passive fiber-to-chip alignment

Wafer-level packaging

Wafer bonding

Lithography

DRIE

Plasma etching

Dicing

SiPh integration

InP integration

TFLN integration

Edge couplers

Grating couplers

Metrology

Reporting skills

Education

MS or PhD in Engineering Physics or related field

Job description

Job Description

Develop package level optical interconnects for advanced Co‑Packaged Optics (CPO) platforms using fan‑out silicon interposer, polymer glass, or 3D stacking technologies interfacing with various optical coupling schemes.

Responsibilities

• Simulate the impact of hybrid bonding interfaces, package stacks, and other packaging elements on optical signal transmission.
• Design silicon and alternative material lenses for optical IOs in wafer‑scale integration.
• Estimate optical losses between grating couplers, edge couplers, and fiber interfaces through lens structures.
• Design package‑level and wafer‑level optical interconnects between GPUs to GPUs and GPUs to memory for multi‑chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high‑density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to advance the state of the art in optical interconnects and testing.

Job Requirements

• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber‑to‑chip coupling such as V grooves, alignment pins, and trench structures.
• Understanding of optical loss mechanisms, alignment tolerances, and packaging‑induced misalignments.
• Knowledge of wafer‑level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
• Familiarity with photonic packaging platforms such as SiPh, InP, and TFLN, and coupling interfaces such as edge couplers and grating couplers.
• Proficiency in microscope‑based alignment metrology and optical loss measurements.
• Strong communication, teamwork, and technical reporting skills.
• MS or PhD in Engineering Physics or a related field.