Research Engineer (Optical Interconnects & Photonic Packaging (Simulation/Modeling))

National University of Singapore; Singapore; On-site; SGD 50,000 - 75,000; Full time

Job summary

The National University of Singapore is seeking a Research Engineer specialized in optical interconnects and photonic packaging. This role emphasizes simulation and modeling for developing a detachable fiber array unit for co-packaged optics, collaborating closely with industry and academic partners.

Candidates should possess a Bachelor’s or Master’s degree in a relevant engineering field and practical experience with simulation tools like ANSYS and COMSOL. The position involves a blend of design, modeling, project management, and collaboration for innovation.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering or equivalent preferred.
• Experience with simulation and modeling for optical or mechanical systems.
• Familiarity with simulation tools is advantageous.

Responsibilities

• Design FAU array geometry and optical coupling schemes.
• Simulate and model optical coupling behavior.
• Contribute research aligning with project objectives.

Skills

Simulation and modeling experience

Collaboration skills

Communication skills

Education

Bachelor’s or Master’s degree in relevant field

Tools

ANSYS Multiphysics

COMSOL Multiphysics

Job description

Job Title: Research Engineer (Optical Interconnects & Photonic Packaging (Simulation/Modeling))

University-Level Unit: College of Design and Engineering

Faculty/Department-Level Unit: Electrical and Computer Engineering

Employee Category: Research Staff

Location_ONB: Kent Ridge Campus

Posting Start Date: 25/05/2026

The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Engineer to support the development of a detachable fiber array unit (FAU) for co-packaged optics (CPO) systems. The role will focus on simulation and modeling. Candidates will contribute to the design, development, and validation of flexible optical coupling structures and standardized optical interfaces for FAU integration in CPO systems, using tools such as ANSYS Multiphysics and/or COMSOL Multiphysics. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers.

Responsibilities

Design

• Design FAU array geometry.
• Develop optical coupling schemes as a unified optical-interface strategy, including vertical coupling and edge coupling.
• Design FAU mechanical alignment structures that provide kinematic constraint in x- and y-axes and angular orientation.
• Select and optimize low-expansion adhesives that maintain optical alignment stability and allow corrective reattachment.

Modeling & Simulation

• Determine the required FAU capacity model, including wavelength tolerances, array flatness, thermo‑optical, and thermo‑mechanical interactions affecting optical alignment.
• Simulate combined optical coupling behavior by evaluating coupling‑element interfaces for vertical coupling and edge coupling.
• Use mechanical modeling to simulate FAU alignment behavior, in particular kinematic coupling of contactor‑target pair during attachment cycles.
• Extend thermo‑mechanical‑optical simulations to study temperature‑driven stress, material expansion mismatch, and drift or relaxation mechanisms.

Project Management & Collaboration

• Contribute research in alignment with project objectives and timelines.
• Support technical reports, publications, and presentations for both academic and industry audiences.

Innovation & Intellectual Property

• Assist in patent filings, technology disclosures, and commercialization efforts.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Physics, Materials Science, Optical Engineering, Photonics or its equivalent from a reputable University/Institute is preferred, or equivalent related experience.
• Candidate with experience in simulation and modeling for optical, mechanical, thermal, thermo‑optical, or thermo‑mechanical systems.
• Familiarity with tools such as ANSYS Multiphysics, COMSOL Multiphysics, Zemax, Lumerical, or equivalent simulation platforms would be advantageous.
• Experience in optical interconnects, fiber arrays, photonic packaging, semiconductor packaging, microelectronics, characterization, metrology, or reliability testing would be an advantage.
• Self‑driven, collaborative, and able to communicate effectively through technical writing and presentations.
• Open to Fixed Term Contract.