Optical Interconnect Architect (2.5D/3D Packaging)

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

A*STAR RESEARCH ENTITIES in Singapore seeks a researcher to advance optical interconnect integration through 2.5D/3D packaging for Co-Packaged Optics and heterogeneous platforms. You will work on test vehicles, alignments, and wafer-level packaging processes with internal and external teams.

You will perform optical simulations, characterize fabricated structures, and help shape architectures for GPU–GPU and multi-chiplet systems. Strong collaboration and documentation skills are essential.

Qualifications

• Strong understanding of optical interconnect integration and advanced packaging concepts for CPO and heterogeneous platforms.
• Knowledge of optical coupling mechanisms, loss sources, alignment tolerances, and package-induced variations.
• Familiarity with photonic integration platforms such as SiPh, InP, and TFLN, including edge- and grating-coupler interfaces.
• Understanding of passive and active optical alignment approaches for fiber-array and chip-level coupling.
• Knowledge of wafer- and package-level fabrication processes (lithography, etching, thinning, bonding, molding, dicing).
• Familiarity with optical simulation and analysis tools for evaluating coupling efficiency and interface performance.

Responsibilities

• Support optical interconnect integration using 2.5D and 3D advanced packaging approaches.
• Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners.
• Develop optical interconnect solutions for Co-Packaged Optics and heterogeneous platforms.
• Perform optical simulation and analysis to assess coupling loss and alignment tolerance.
• Design and evaluate optical coupling structures (edge- and grating-couplers, lens-assisted, fiber-array interfaces).
• Develop passive fiber alignment concepts and detachable low-loss connector schemes.
• Contribute to interconnect architectures for multi-chiplet system-level packaging.
• Perform optical and electro-optical characterization of fabricated structures and testing setups.

Skills

Optical interconnect

Advanced packaging

SiPh integration

InP platforms

TFLN familiarity

Edge/grating couplers

Fiber-array coupling

Tools

Optical simulation tools

Job description

A*STAR RESEARCH ENTITIES in Singapore seeks a researcher to advance optical interconnect integration through 2.5D/3D packaging for Co-Packaged Optics and heterogeneous platforms. You will work on test vehicles, alignments, and wafer-level packaging processes with internal and external teams.

You will perform optical simulations, characterize fabricated structures, and help shape architectures for GPU–GPU and multi-chiplet systems. Strong collaboration and documentation skills are essential.