Senior Scientist, Optical Interconnect Integration, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research is seeking candidates for a role focusing on optical interconnect integration. Responsibilities include supporting package development and fabrication processes, performing optical simulation analysis, and collaborating with internal and external partners.

Ideal candidates will have a strong understanding of optical interconnects and packaging concepts, with skills in optical coupling mechanisms and testing techniques. The position is critical in advancing Co-Packaged Optics technologies in Singapore.

Qualifications

• Strong understanding of optical interconnect integration for CPO and heterogeneous platforms.
• Knowledge of optical loss sources and alignment tolerances.
• Familiarity with Silicon Photonics and related technologies.
• Ability to support process integration activities and collaboration.

Responsibilities

• Support optical interconnect integration using advanced packaging approaches.
• Develop package-level optical interconnect solutions.
• Perform optical simulation and analysis for performance assessment.
• Coordinate fabrication and integration of test vehicles.

Skills

Optical interconnect integration

Advanced packaging concepts

Optical coupling mechanisms

Optical simulation tools

Analytical skills

Problem-solving skills

Teamwork

Job description

Responsibilities

• Support optical interconnect integration using 2.5D and 3D advanced packaging approaches.
• Understand and generate package design layouts, process-flow concepts, test vehicle plans, and validation strategies.
• Coordinate fabrication, assembly, and integration of optical interconnect test vehicles with internal teams and external partners.
• Develop advanced package-level and wafer-level optical interconnect solutions for Co-Packaged Optics (CPO) and heterogeneous integration platforms.
• Perform optical simulation and analysis to assess coupling loss, alignment tolerance, package-stack effects, and interface-related optical performance.
• Design and evaluate optical coupling structures, including grating-coupler, edge-coupler, lens-assisted, and fiber-array-based interfaces.
• Develop passive fiber alignment concepts and detachable low-loss optical connector schemes for high-density optical I/O integration.
• Contribute to optical interconnect architectures for GPU–GPU, GPU–memory, and multi-chiplet system-level packaging applications.
• Perform optical and electro-optical characterization of fabricated structures, including optical loss, coupling efficiency, high-speed modulation response, eye-diagram, and link-level performance evaluation.
• Support package-level electro-optical testing of optical interconnect test vehicles using relevant optical, RF, and high-speed measurement setups.
• Propose new concepts to improve optical coupling efficiency, alignment tolerance, manufacturability, and testability of next-generation CPO platforms.

Requirements

• Strong understanding of optical interconnect integration and advanced packaging concepts for Co-Packaged Optics (CPO) and heterogeneous integration platforms.
• Knowledge of optical coupling mechanisms, optical loss sources, alignment tolerances, and package-induced optical performance variations.
• Familiarity with photonic integration platforms such as Silicon Photonics (SiPh), Indium Phosphide (InP), and Thin-Film Lithium Niobate (TFLN), including edge-coupler and grating-coupler interfaces.
• Understanding of passive and active optical alignment approaches for fiber-array and chip-level optical coupling structures.
• Knowledge of wafer-level and package-level fabrication processes, including lithography, plasma etching, wafer thinning, bonding, molding, and dicing processes.
• Familiarity with optical simulation and analysis tools for evaluating coupling efficiency, alignment sensitivity, and optical interface performance.
• Understanding of optical and electro-optical characterization techniques, including optical loss measurement, high-speed modulation testing, eye-diagram evaluation, and package-level optical testing.
• Familiarity with microscope-based inspection, metrology, and laboratory characterization.
• Ability to support process integration activities, and collaboration with internal teams and external partners.
• Strong analytical, problem-solving, communication, teamwork, and technical documentation skills.