R&D Senior / Engineers

BLESSED AGAPE CONNECTIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

BLESSED AGAPE CONNECTIONS PTE. LTD. in Singapore is seeking an engineering professional to design, qualify, and optimize advanced semiconductor packaging processes that meet strict design rules and high-density requirements.

You will lead projects, drive yield improvement, and support technology qualification and transfer. The role requires 3+ years in R&D or mass production, strong data analysis skills, experience with DoE and FA, and the ability to communicate technical results for

Qualifications

• Bachelor's degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials.
• 3+ years of R&D or mass production experience in semiconductor processes.
• Proficiency with data analysis tools (e.g., JMP, MATLAB, Excel).
• Strong analytical and problem-solving skills.
• Experience in customer-driven development programs and technical issue resolution for semiconductor packaging solutions.

Responsibilities

• To design, qualify, and optimize advanced processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
• Lead assigned projects.
• Yield Improvement & Yield Failure Analysis (FA)
• Technology Qualification & Transfer
• Equipment & Material Evaluation

Skills

Data analysis

Analytical skills

DoE

Failure analysis

Customer-driven development

Technical data reporting

Education

Bachelor's degree

Tools

JMP

MATLAB

Excel

Job description

R&D Areas

• R&D - Lithography
• R&D - Underfill / Cure
• R&D - Plating, PR Strip, Wet Etch
• R&D - CA & TCB

Responsibilities

• To design, qualify, and optimize advanced processes that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
• Lead assigned projects.
• Yield Improvement & Yield Failure Analysis (FA)
• Technology Qualification & Transfer
• Equipment & Material Evaluation

Requirements

• Bachelor's degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials
• R&D or mass production experience of at least three years in processes
• Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel)
• Strong analytical and problem-solving skills
• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
• Experience in customer-driven development programs, customer qualification, and technical issue resolution for semiconductor packaging solutions.