Wafer Fab Process Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED is seeking an experienced process leader to drive development, optimization, and transfer of semiconductor processes to manufacturing, targeting higher yield, quality and reliability.

You will own advanced process modules such as thin film deposition, wafer thinning, thermal oxidation, diffusion and implantation, lead NPI efforts, and mentor junior engineers while collaborating with equipment, quality and R&D teams to deliver robust solutions.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
• 5+ years of semiconductor wafer fab process experience in thin film deposition or thermal processes.
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis.
• Proven leadership in cross-functional technical projects.
• Excellent analytical, problem-solving, and communication skills.

Responsibilities

• Own and drive advanced process modules (thin film deposition, wafer thinning, thermal oxidation, diffusion, implantation).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and transfer to high-volume manufacturing.
• Perform root cause analysis and implement corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Skills

SPC

DOE

FMEA

Statistical data analysis

Leadership

Analytical

Communication

Education

Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related)

Job description

Job Summary

Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

• Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).

• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.

• Drive new process integration (NPI) and process transfer to high-volume manufacturing.

• Perform root cause analysis and implement robust corrective/preventive actions.

• Define process control plans, SPC strategies, and OCAP execution.

• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.

• Mentor junior engineers and technicians.

• Interface with suppliers on process and material improvements.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).

• At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation.

• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.

• Demonstrated leadership in cross-functional technical projects.

• Strong analytical, problem-solving, and communication skills

Preferred

• PhD in Engineering (Electrical, Chemical, Materials, or related).

• Six Sigma certification (Green/Black Belt).

• Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.