Wafer Fab Process Engineer

Broadcom; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Broadcom seeks an experienced process-development leader to drive advanced wafer fabrication modules and transfer to high-volume manufacturing. You will lead optimization efforts for thin film and thermal processes, mentor engineers, and collaborate with equipment, quality, and R&D teams to meet yield, quality, cost, and reliability targets.

The role requires 5+ years in semiconductor wafer fab processes, strong skills in SPC/DOE/FMEA, and proven problem-solving abilities.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
• At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
• Demonstrated leadership in cross-functional technical projects.
• Strong analytical, problem-solving, and communication skills.

Responsibilities

• Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high-volume manufacturing.
• Perform root cause analysis and implement robust corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Skills

Leadership

Statistical analysis

DOE

FMEA

Cross-functional collaboration

Problem solving

Education

Bachelor’s or Master’s in Engineering

PhD in Engineering

Job description

Job Summary

Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Job Description

Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

• Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high-volume manufacturing.
• Perform root cause analysis and implement robust corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
• At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
• Demonstrated leadership in cross-functional technical projects.
• Strong analytical, problem-solving, and communication skills

Preferred

• PhD in Engineering (Electrical, Chemical, Materials, or related).
• Six Sigma certification (Green/Black Belt).
• Experience supporting 4\" to 6\" wafer scaling or equivalent manufacturing transition.

R026529