R&D Engineer (Packaging Process)

ARETE RESOURCES PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

ARETE RESOURCES PTE. LTD. is seeking an experienced R&D packaging process engineer to design and implement packaging processes for isolation products in Singapore.

You will collaborate with IC designers, product engineers and manufacturing teams to drive device validation and process development. The role emphasizes die attach, wire bond, encapsulation molding, vision inspection, and leading NPI projects from verification to high-volume soft launch, with a focus on reliability, yield, and cost

Qualifications

• Experienced R&D packaging process engineer with ME background.
• Proven skills in die attach, wire bonding, encapsulation, and molding.
• Familiar with IC packaging, high voltage isolation, and failure analysis.
• Experience leading NPI projects from verification to high-volume launches.

Responsibilities

• Design/implement packaging processes for new isolation products.
• Evaluate material reliability and explore new production methods.
• Perform DOE and optimize new processes.
• Collaborate with IC designers, product engineers and manufacturing to validate new devices.
• Conduct process yield analysis and investigate device failures.
• Plan engineering programs to meet cost, yield, quality, and reliability targets.

Skills

Die Attach

Wire Bond

Encapsulation Molding

Package Trim/Forming

Vision Inspection Tools

Semiconductor Packaging

Analytical Thinking

Problem Solving

Tools

Lead-frame Design Tools

Material Processing Techniques

Failure Analysis Techniques

Job description

R & D ENGINEER, PACKAGING PROCESS

(ISOLATION PRODUCTS)

Job description

• Responsible for designing/ implementing packaging process of new isolation products.
• Evaluates reliability of materials, properties and techniques, explore new process methodology used in production.
• Perform Design of Engineering Experiment (DOE) and optimization of new developed processes.
• Carry out R&D programs with IC designer, product engineer and manufacturing team, various support functions and contract Manufacturer to develop and perform process validation of new devices.
• Perform process yield analysis and failure investigation of new device issues.
• Plan and carry out engineering programs to achieve cost targets, breakthrough improvement in manufacturing yield, quality and reliability

Requirement:

• We are looking for an experienced R&D packaging process engineer.
• We need people with a strong ME background, semiconductor packaging process development skill. e.g. Die Attach, Wire bond, encapsulation Molding, package trim/forming, vision inspection tools
• Demonstrated and proven analytical/ critical thinking, problem solving and solution provider.
• Familiarized with mechanical lead-frame design rules/ tools, knowledge in semiconductor physical failure analysis.
• Experience in IC packaging, high voltage isolation requirements, material and processing techniques.
• Roles in NPI project leadership, taking product from verification/ qualification to high volume soft launch is advantageous.