R&D Packaging Process Engineer – IC Packaging & Yield

ARETE RESOURCES PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

ARETE RESOURCES PTE. LTD. seeks an R&D Engineer to design and implement packaging processes for isolation products, evaluating materials and techniques.

You will collaborate with IC designers, product engineers and manufacturing teams to scale from verification to high-volume production. The role requires a strong ME background in semiconductor packaging, hands-on experience with die attach, wire bonding, encapsulation molding, and vision inspection tools.

Qualifications

• R&D packaging process development and validation experience.
• Strong mechanical engineering background in semiconductor packaging.
• Proven analytical thinking and problem-solving skills.
• Familiar with lead-frame design rules and inspection tools.
• Experience in IC packaging and high-voltage isolation is a plus.

Responsibilities

• Design and implement packaging processes for new isolation products.
• Perform DOE and optimize developed processes.
• Collaborate with IC designers, product engineers, and manufacturing teams to develop and validate processes.
• Lead process validation with contract manufacturers.

Skills

Packaging process

Semiconductor packaging

DOE

Analytical thinking

Problem solving

NPI leadership

Cost optimization

Education

Mechanical Engineering

Tools

Die Attach

Wire Bonding

Encapsulation Molding

Package Trim/Forming

Vision inspection tools

Lead-frame design rules

Job description

ARETE RESOURCES PTE. LTD. seeks an R&D Engineer to design and implement packaging processes for isolation products, evaluating materials and techniques.

You will collaborate with IC designers, product engineers and manufacturing teams to scale from verification to high-volume production. The role requires a strong ME background in semiconductor packaging, hands-on experience with die attach, wire bonding, encapsulation molding, and vision inspection tools.