R&D Process Engineer

Broadcom Singapore Pte Ltd; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Broadcom Singapore Pte Ltd in Singapore is seeking an experienced R&D Process Engineer specializing in optocoupler packaging to design and implement advanced manufacturing processes.

You will apply DOE, lead NPI and improvement projects, and collaborate with IC designers, production teams, and suppliers to achieve cost, yield, and reliability goals.

A strong mechanical engineering background and hands-on skills in Die Attach, Wire Bonding, Encapsulation, and inspection tools are required.

Qualifications

• Bachelor's degree in Mechanical Engineering or related field.
• Experience in semiconductor packaging processes.
• Experience with DOE methods (Design of Experiments).
• Experience with NPI projects from verification to high-volume launch.
• Familiarity with leadframe design rules/tools and failure analysis is a plus.

Responsibilities

• Design and implement packaging processes for new isolation products.
• Evaluate material reliability, properties, and processing techniques.
• Conduct DOE and optimize developed processes.
• Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes.
• Perform process yield analysis and investigate new device-related issues.
• Plan and execute programs to reduce costs and improve yield, quality, and reliability.

Skills

Analytical thinking

Problem-solving

Solution-oriented mindset

Team collaboration

Detail-oriented

Education

Mechanical Engineering degree

Tools

SolidWorks

ANSYS

CAD tools

Job description

Job Description:

• Responsible for the design and implementation of packaging processes for new isolation products.
• Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.
• Conduct Design of Experiments (DOE) and optimize newly developed processes.
• Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.
• Perform process yield analysis and failure investigations for new device-related issues.
• Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.

Requirement:

• We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.
• Strong background in Mechanical Engineering and semiconductor packaging process development.
• Hands‑on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.
• Demonstrated analytical and critical thinking skills with strong problem‑solving capabilities and a solution‑oriented mindset.
• Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.
• Experience in IC packaging, high‑voltage isolation requirements, materials, and processing techniques.
• Experience leading NPI projects and taking products from verification/qualification through high‑volume soft launch is an advantage.
• Experience in Solidworks/ Ansys, CAD and simulation tools

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.