Engineer – Equipment, Wafer Prep Engineering

UTAC; Singapore; On-site; SGD 42,000 - 68,000; Full time

Job summary

UTAC in Singapore seeks a wafer preparation equipment engineer to perform routine maintenance, troubleshooting, and repair of Backgrinding Mounter, Laser Groove, and Dicing Saw systems. You will monitor production levels and diagnose issues to minimize downtime, while collaborating with process engineers on improvement projects.

The role also involves optimizing machine parameters, supporting new device ramp-ups, and providing guidance to junior staff, with a focus on quality and safety.

Qualifications

• Degree in Engineering.
• Experience in semiconductor equipment, wafer prep engineering.
• Knowledge of SPC (Statistical Process Control) and MSA (Measurement System Analysis).
• Good documentation, reporting and communication skills.

Responsibilities

• Perform routine maintenance, troubleshooting, and repair of wafer preparation equipment, including Backgrinding Mounter, Laser Groove, and Dicing Saw machines.
• Ensure equipment operates at target production levels.
• Diagnose and resolve equipment malfunctions to minimize downtime.
• Monitor and adjust machine parameters to maintain production quality.
• Collaborate with process engineers to develop and execute improvement projects.
• Support ramp-up of new devices and technologies.
• Provide technical guidance and training to junior engineers and technicians.

Skills

SPC

MSA

Laser operation

Documentation

Education

Engineering degree

Job description

• Perform routine maintenance, troubleshooting, and repair of wafer preparation equipment, including: Backgrinding Mounter machines, Laser Groove machines, Dicing Saw machines
• Ensure equipment is operating at optimal performance levels to meet production target
• Diagnose and resolve equipment malfunctions to minimize downtime
• Monitor and adjust machine parameters to maintain production quality
• Ensure optimal performance of relevant equipment systems, including sub-chuck and interval blade dressing systems for Dicing Saw machines
• Monitor and analyse wafer backgrinding, mounting, laser grooving, and dicing processes to identify areas for improvement
• Implement process control tools to enhance production efficiency and quality
• Identify opportunities to enhance equipment performance and process efficiency
• Collaborate with process engineers to develop and execute improvement projects
• Participate in continuous improvement initiatives to improve quality, delivery, and cost
• Support machine qualification and process evaluation where required
• Conduct failure analysis and troubleshooting to identify root causes of equipment and process issues
• Support the ramp-up of new devices and technologies
• Maintain safety and quality standards through regular checks and proactive issue prevention
• Provide technical guidance and training to junior engineers and technicians
• Collaborate with internal teams and external vendors to resolve equipment and production issues
• Prepare equipment and maintenance reports, communicate updates to stakeholders, and stay abreast of industry and wafer preparation technology advancements

Requirements:

• Degree in Engineering
• Relevant experience in semiconductor equipment, wafer prep engineering
• Basic knowledge of SPC (Statistical Process Control) and MSA (Measurement System Analysis)
• Knowledge of laser operation and maintenance is an advantage
• Good documentation, reporting, and communication skills