Engineer - Test Process (WLCSP)

ASE SINGAPORE PTE. LTD.; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

ASE Singapore PTE. LTD. is seeking a seasoned engineer to support advanced semiconductor production, from taping and backgrind to laser marking and dicing, ensuring stable output and tight process control.

You will lead device introductions, optimize recipes, troubleshoot issues, and maintain crucial documentation while driving continuous improvement and strict safety and 5S standards.

Qualifications

• Bachelor's Degree in Engineering or a related technical discipline.
• 3+ years of experience within a semiconductor manufacturing environment.
• Hands-on experience operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
• Strong command of core quality tools: 8D, FMEA, Control Plans, and SPC.

Responsibilities

• Support production operations across Taping, Backgrind, Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
• Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
• Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
• Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
• Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and OCAPs.
• Generate technical reports and preserve accurate engineering data for audit readiness.
• Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
• Drive continuous improvement by executing CIP focused on quality enhancement, yield optimization, and cost reduction.
• Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.

Skills

Problem solving

Cross-functional collaboration

Documentation

Education

Bachelor's degree in Engineering

Tools

8D problem-solving

FMEA

Control Plans

SPC

Job description

Responsibilities

• Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
• Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
• Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
• Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
• Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
• Generate technical reports and preserve accurate engineering data for audit readiness.
• Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
• Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
• Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.

Requirements

• Bachelor's Degree in Engineering or a related technical discipline.
• 3+ years of experience within a semiconductor manufacturing environment.
• Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
• Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.