Process Engineer: Die Attach, Wire Bond & Optical Alignment

Lumilens; Singapore; On-site; SGD 60,000 - 90,000; Full time

Benefits offered by this job

Competitive salary

Career advancement

World-class team

Innovative environment

Job summary

Lumilens in Singapore is seeking hands-on Process Engineers to support volume manufacturing ramp-up at the Bulim facility. You will drive process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

The role covers Die Attach, Wire Bond, Active Alignment, and End-to-End Line Integration, with responsibilities spanning setup, optimization, SPC/DOE, and cross‑functional

Qualifications

• Education: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.
• Experience: 2+ years in semiconductor packaging, microelectronics, SMT, or optical module manufacturing.
• Domain Expertise: SPC tools, GD&T, and structured problem‑solving methods.
• On-site work at the Bulim plant during ramp-up.

Responsibilities

• Establish robust process windows, parameter recipes, and SOPs for assigned modules.
• Monitor yield metrics, perform 8D root-cause analysis, implement corrective actions.
• Qualify tooling, materials, and automation for high-volume ramp (NPI→Mass).
• Apply SPC, DOE, FMEA, and Cpk to improve stability and reduce cycle time.
• Collaborate with Operators, Quality, and Maintenance to resolve line stops.

Skills

Problem solving

Cross-functional collaboration

On-site support

Education

Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering

Tools

SPC tools (JMP, Minitab)

GD&T

8D/5-Why/Fishbone

Job description

Lumilens in Singapore is seeking hands-on Process Engineers to support volume manufacturing ramp-up at the Bulim facility. You will drive process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

The role covers Die Attach, Wire Bond, Active Alignment, and End-to-End Line Integration, with responsibilities spanning setup, optimization, SPC/DOE, and cross‑functional