Die Attach Engineer, Silicon Photonics Packaging

Lumilens; Singapore; On-site; SGD 120,000 - 180,000; Full time

Benefits offered by this job

Competitive salary and benefits

Career growth opportunities

Diversity and inclusion

Job summary

Lumilens in Singapore is seeking a Die Attach Manufacturing Engineer – Process & Equipment to lead die attach and equipment qualification for PIC packaging. You will drive sub-micron alignment, material selection, and process optimization for high optical coupling efficiency.

You will collaborate with design, reliability, and operations, establishing DOE-based process windows, CAPA, and NPI support for photonic packages. This role offers exposure to cutting-edge photonics manufacturing.

Qualifications

• Bachelor's degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering or related field.
• 3–7 years of hands-on experience in silicon photonics/PIC industry focusing on die attach process/equipment engineering.
• Direct experience with silicon photonics dies and/or III-V laser dies incl. wafer/die handling and alignment.
• Knowledge of die attach materials/methods for photonics (low-outgassing epoxies, UV-cure adhesives, AuSn/eutectic).
• Experience with high-precision die/fiber attach equipment (Besi, Palomar, Finetech, Set North America, PI).
• Familiarity with DOE, SPC, Cpk analysis and structured problem-solving for optical coupling yield.

Responsibilities

• Develop, qualify, and optimize die attach processes for PICs and related assemblies.
• Establish process specifications, work instructions, and control plans.
• Lead CAPA for yield loss and defects (misalignment, coupling loss, voids).
• Support NPI by developing die attach process flows for new photonic packages.
• Monitor process capability data and drive improvements to reduce variation.

Skills

Sub-micron alignment

Die attach process

High-precision equipment

DOE SPC

Optical coupling

Problem solving

Education

Bachelor's in Electrical/Mechanical/Optics

Master's preferred

Tools

Besi equipment

Palomar tech

Finetech

PI/Physik Instrumente

Job description

Lumilens in Singapore is seeking a Die Attach Manufacturing Engineer – Process & Equipment to lead die attach and equipment qualification for PIC packaging. You will drive sub-micron alignment, material selection, and process optimization for high optical coupling efficiency.

You will collaborate with design, reliability, and operations, establishing DOE-based process windows, CAPA, and NPI support for photonic packages. This role offers exposure to cutting-edge photonics manufacturing.