Die Attach Engineer, Silicon Photonics Packaging

Lumilens

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+

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Benefits offered by this job

Competitive salary and benefits

Career growth opportunities

Diversity and inclusion

Job summary

Lumilens in Singapore is seeking a Die Attach Manufacturing Engineer – Process & Equipment to lead die attach and equipment qualification for PIC packaging. You will drive sub-micron alignment, material selection, and process optimization for high optical coupling efficiency.

You will collaborate with design, reliability, and operations, establishing DOE-based process windows, CAPA, and NPI support for photonic packages. This role offers exposure to cutting-edge photonics manufacturing.

Qualifications

Bachelor's degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering or related field.
3–7 years of hands-on experience in silicon photonics/PIC industry focusing on die attach process/equipment engineering.
Direct experience with silicon photonics dies and/or III-V laser dies incl. wafer/die handling and alignment.
Knowledge of die attach materials/methods for photonics (low-outgassing epoxies, UV-cure adhesives, AuSn/eutectic).
Experience with high-precision die/fiber attach equipment (Besi, Palomar, Finetech, Set North America, PI).
Familiarity with DOE, SPC, Cpk analysis and structured problem-solving for optical coupling yield.

Responsibilities

Develop, qualify, and optimize die attach processes for PICs and related assemblies.
Establish process specifications, work instructions, and control plans.
Lead CAPA for yield loss and defects (misalignment, coupling loss, voids).
Support NPI by developing die attach process flows for new photonic packages.
Monitor process capability data and drive improvements to reduce variation.