Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)

Lumilens

Singapore

On-site

SGD 60,000 - 90,000

Full time

14 days+
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Benefits offered by this job

Competitive salary
Career advancement
World-class team
Innovative environment

Job summary

Lumilens in Singapore is seeking hands-on Process Engineers to support volume manufacturing ramp-up at the Bulim facility. You will drive process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

The role covers Die Attach, Wire Bond, Active Alignment, and End-to-End Line Integration, with responsibilities spanning setup, optimization, SPC/DOE, and cross‑functional

Qualifications

  • Education: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.
  • Experience: 2+ years in semiconductor packaging, microelectronics, SMT, or optical module manufacturing.
  • Domain Expertise: SPC tools, GD&T, and structured problem‑solving methods.
  • On-site work at the Bulim plant during ramp-up.

Responsibilities

  • Establish robust process windows, parameter recipes, and SOPs for assigned modules.
  • Monitor yield metrics, perform 8D root-cause analysis, implement corrective actions.
  • Qualify tooling, materials, and automation for high-volume ramp (NPI→Mass).
  • Apply SPC, DOE, FMEA, and Cpk to improve stability and reduce cycle time.
  • Collaborate with Operators, Quality, and Maintenance to resolve line stops.

Skills

Problem solving
Cross-functional collaboration
On-site support

Education

Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering

Tools

SPC tools (JMP, Minitab)
GD&T
8D/5-Why/Fishbone

Job description

About Lumilens

At Lumilens, we are building the essential photonics infrastructure that will drive tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is ushering in a new era of computing that is faster, cooler, and dramatically more efficient. We’re a well-funded startup backed by Mayfield and led by veterans who have built and scaled some of the industry’s most transformative technologies.

About the Role

We are seeking hands-on Process Engineers to support our volume manufacturing ramp-up at our Bulim facility. In this role, you will be responsible for process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines.

We are hiring across multiple domain specializations:

  • Die Attach (DB / Die Bond)

  • Wire Bond (WB)

  • Active Alignment (AA / Optical Alignment)

  • Process Engineering – Overall / Integration

Key Responsibilities

  • Process Setup & Optimization: Establish robust process windows, parameter recipes, and standard operating procedures (SOPs) for assigned production modules (DB, WB, AA, or End‑to‑End Line Integration).

  • Yield & Defect Reduction: Monitor line yield metrics, lead 8D root‑cause failure analysis (FA), and implement corrective actions for recurring process/equipment defects.

  • NPI to Mass Production: Partner with NPI and Equipment Engineering to qualify new tooling, materials (epoxies, substrates, bonding wire), and automation platforms for high‑volume ramp.

  • Statistical Process Control: Apply SPC, DOE, FMEA, and Cpk analysis to drive process stability, cycle time reduction, and cost‑efficiency initiatives.

  • Cross‑Functional Collaboration: Work closely with Manufacturing Operators, Quality Engineers, and Maintenance Technicians to resolve line stops and uphold quality standards.

Qualifications & Requirements

  • Education: Bachelor’s Degree or Diploma in Mechanical, Electrical/Electronic, Mechatronics, Materials Science, or Manufacturing Engineering.

  • Experience: 2+ years of relevant process engineering experience in semiconductor packaging, microelectronics, surface‑mount technology (SMT), or camera/optical module manufacturing.

  • Domain Expertise (one or more of the following):

  • Technical Skills: Proficiency in SPC tools (JMP, Minitab), GD&T, and structured problem‑solving methodologies (8D, 5‑Why, Fishbone).

  • Work Arrangement: Willingness to work on‑site at the Bulim plant and support operational needs during ramp‑up phases.

Benefits
  • Competitive salary and benefits

  • Opportunities for career advancement

  • Work with a world‑class team solving cutting‑edge challenges

  • Collaborative and innovative work environment

Lumilens is committed to building a diverse and inclusive workplace. We are proud to be an equal opportunity employer.

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