Optical Transceiver Process Lead — High-Volume Assembly

Lumilens; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Lumilens in Singapore seeks an experienced Process Engineer to own manufacturing processes for the 800G and 1.6T transceiver roadmap. This hands‑on role covers die attach, wire bond, active alignment, and general assembly from definition through high‑volume production.

You will work with contract manufacturers, equipment suppliers, and internal QA teams to enable yield, continuous improvement, and scalable production for AI data center applications.

Qualifications

• Bachelor's degree in a related engineering field.
• 7+ years in high-volume optical transceiver or laser manufacturing.
• Excellent problem‑solving and analytical skills.
• In-depth technical knowledge of manufacturing processes, equipment, and materials for optical assemblies.

Responsibilities

• Define, develop, prove out, and deploy manufacturing processes across die attach, wire bond, active alignment, and general assembly.
• Own process documentation (Specs, work instructions, control plans, FMEA) and review/approve changes on the production line.
• Maintain end-to-end manufacturing ownership and manage changes under QMS requirements.
• Lead or support equipment selection and new equipment introduction with suppliers and stakeholders.
• Collaborate with design engineering and CM teams to ensure DFx guidelines are met.
• Coordinate with quality to plan qualification, reliability, and burn‑in testing for new products and changes.
• Analyze process and yield data to identify root causes and drive corrective actions.
• Prepare process reports by collecting and summarizing trends.
• Automate manufacturing processes where possible to support scale‑up and high‑volume production.

Skills

Problem-solving

Data analysis

SPC

Communication skills

Team collaboration

Education

Bachelor's degree in Electrical/Industrial/Mechanical Engineering or Physics

Job description

Lumilens in Singapore seeks an experienced Process Engineer to own manufacturing processes for the 800G and 1.6T transceiver roadmap. This hands‑on role covers die attach, wire bond, active alignment, and general assembly from definition through high‑volume production.

You will work with contract manufacturers, equipment suppliers, and internal QA teams to enable yield, continuous improvement, and scalable production for AI data center applications.