Process Engineer - Die Attach, Wire Bond & Active Alignment

Lumilens Inc.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Benefits offered by this job

Competitive salary

Career advancement

World-class team

Collaborative culture

Job summary

Lumilens Inc. in Singapore seeks hands-on Process Engineers to support our volume manufacturing ramp-up at the Bulim facility.

You will lead process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines. Ideal candidates bring 2+ years in semiconductor packaging or SMT, with domain expertise in Die Bond, Wire Bond, Active Alignment, or end-to-end process.

Qualifications

• Bachelor’s Degree or Diploma in relevant engineering.
• 2+ years in semiconductor packaging, microelectronics, SMT, or optical module manufacturing.
• Domain expertise in Die Bond, Wire Bond, Active Alignment, or End-to-End Process.
• Proficiency with SPC tools and structured problem solving.

Responsibilities

• Establish robust process windows and SOPs for modules (DB, WB, AA, or End-to-End).
• Monitor line yield and perform 8D root-cause analyses; implement corrective actions.
• Qualify tooling, materials, and automation platforms for high-volume ramp.
• Apply SPC, DOE, FMEA, and CpK analysis to drive process stability and cost-efficiency.
• Collaborate with Operators, Quality, and Maintenance to resolve line stops and uphold quality.

Skills

SPC Tools

GD&T

8D Methods

5-Why

Fishbone

Education

Bachelor’s Degree

Diploma

Tools

JMP

Minitab

Job description

Lumilens Inc. in Singapore seeks hands-on Process Engineers to support our volume manufacturing ramp-up at the Bulim facility.

You will lead process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines. Ideal candidates bring 2+ years in semiconductor packaging or SMT, with domain expertise in Die Bond, Wire Bond, Active Alignment, or end-to-end process.