Process & Application Engineer – Die Bonding (Semiconductor) | Up to $6k / 5 days / Woodlands | 0580

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking an engineer to lead design, development, optimization, and validation of software and hardware for advanced die bonding processes in a Woodlands North Coast setting.

The role includes translating customer requirements into customized packaging solutions and focusing on process optimization and performance. You will troubleshoot die attach tools, participate in on-site installations, and collaborate with R&D, software, mechanical, electrical, quality,

Qualifications

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer-level, or panel-level bonding).
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Willingness to travel for customer support and on-site installations.

Responsibilities

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Skills

Semiconductor packaging

Die bonding equipment

Advanced packaging technologies

Motion control systems

Troubleshooting

Customer support

Education

Bachelor’s or Master’s degree in Engineering

Job description

• Working Location: Woodlands North Coast
• Working Days: Monday - Friday
• Working Hours: 9:00am -6:00pm
• Starting Salary: $3,000 to $6,000

Responsibilities

• Lead thedesign, development, optimization, and validationof software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing onprocess optimization and application performance.
• Conducttroubleshooting and failure analysisof die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Performmachine setup, calibration, and alignmentto ensure optimal process performance, repeatability, and yield.
• Developtest procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate withR&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provideon-site supportfor complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface betweencustomers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Job Requirement

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Willingness to travel for customer support and on-site installations (as required).