MNC 5 days Application / Process Engineer (Die Bond) up to $6000

Talent Recruitment Pte Ltd; Singapore; On-site; SGD 45,000 - 67,000; Full time

Benefits offered by this job

AWS

Bonus

Annual Leave 14-21 days

Birthday Leave

Flexible Benefit

Job summary

Talent Recruitment Pte Ltd is seeking an Application / Process Engineer (Die Bond Tools) in Woodlands, Singapore. The role focuses on developing, optimizing, and validating die bonding processes and equipment to achieve high production yields.

You will calibrate machines, troubleshoot issues, and work with R&D, software, mechanical, electrical, manufacturing and quality teams to drive product improvements. Travel to customer sites for installation and support may be required.

Qualifications

• Semiconductor manufacturing experience is required.
• Bachelor's or Master's Degree in Mechanical, Electrical, Materials Engineering or a related discipline.
• Hands-on troubleshooting in manufacturing or lab settings preferred.

Responsibilities

• Develop, optimize and validate die bonding processes, applications and equipment.
• Set up, calibrate and qualify machines to achieve optimum performance and production yield.
• Troubleshoot equipment and process issues, and implement corrective actions.
• Develop process recipes, test procedures and technical documentation.
• Work with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.
• Provide technical support, equipment installation and application support at customer sites.
• Conduct customer training and support Field Application Engineers on equipment operation.
• Liaise with customers to understand requirements and recommend semiconductor packaging solutions.
• Gather customer feedback and work with R&D on product improvements.

Skills

Semiconductor manufacturing experience

Die bonding

Process development

Troubleshooting

Team collaboration

Education

Bachelor's or Master's Degree in Mechanical, Electrical, Materials Engineering or related

Tools

Semiconductor equipment

Motion control systems

Process control software

Job description

Application / Process Engineer (Die Bond Tools)
$4,000 – $6,000
9am - 6pm (Monday – Friday)
Woodlands
Benefit: AWS, Bonus, Annual Leave (14 - 21 days), Birthday Leave, Flexible Benefit

Job Responsibilities

• Develop, optimize and validate die bonding processes, applications and equipment.

• Set up, calibrate and qualify machines to achieve optimum performance and production yield.

• Troubleshoot equipment and process issues, and implement corrective actions.

• Develop process recipes, test procedures and technical documentation.

• Work closely with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.

• Provide technical support, equipment installation and application support at customer sites.

• Conduct customer training and support Field Application Engineers on equipment operation.

• Liaise with customers to understand application requirements and recommend suitable semiconductor packaging solutions.

• Gather customer feedback and work with the R&D team on product improvements.

Requirements

• Bachelor's or Master's Degree in Mechanical, Electrical, Materials Engineering or a related discipline.

• Semiconductor manufacturing experience is required.

• Minimum 3 years of experience in semiconductor packaging, die bonding equipment or advanced electronics manufacturing.

• Good knowledge of advanced semiconductor packaging technologies (e.g. Flip Chip, PoP, WLP and PLP).

• Experience with semiconductor equipment, motion control systems and process development is an advantage.

• Hands-on troubleshooting and problem-solving experience in a manufacturing or laboratory environment.

• Good communication skills and able to work independently as well as in a team.

• Willing to travel for customer support, equipment installation and on-site technical assistance when required.