5 days Application / Process Engineer (Die Bond Tools) up to $6000

TALENT RECRUITMENT PTE. LTD.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

Talent Recruitment Pte Ltd in Singapore is seeking an Applications / Process Engineer specializing in Die Bond Tools to join a multidisciplinary team. You will develop, optimize, and validate die bonding processes, set up equipment, and deliver on-site technical support.

The role requires a degree in Mechanical, Electrical, or Materials Engineering and at least three years in semiconductor packaging or die bonding.

Qualifications

• Bachelor's or Master's degree in Mechanical, Electrical, Materials Engineering or related.
• Semiconductor packaging experience is required.
• Minimum 3 years in semiconductor packaging, die bonding equipment or advanced electronics manufacturing.
• Knowledge of Flip Chip, PoP, WLP and PLP is desirable.
• Experience with semiconductor equipment and process development is an asset.

Responsibilities

• Develop, optimize and validate die bonding processes, applications and equipment.
• Set up, calibrate and qualify machines to achieve optimum performance and production yield.
• Troubleshoot equipment and process issues, and implement corrective actions.
• Develop process recipes, test procedures and technical documentation.
• Collaborate with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.
• Provide technical support and installation at customer sites; conduct customer training.

Skills

Semiconductor packaging

Die bonding equipment

Troubleshooting

Communication

Team collaboration

Education

Bachelor's or Master's in Mechanical/Electrical/Materials Engineering

Tools

Motion control systems

Semiconductor equipment

Process development

Job description

Application / Process Engineer (Die Bond Tools)

$3,000 – $6,000

Monday – Friday, 9:00am – 6:00pm

Woodlands

Job Responsibilities

• Develop, optimize and validate die bonding processes, applications and equipment.
• Set up, calibrate and qualify machines to achieve optimum performance and production yield.
• Troubleshoot equipment and process issues, and implement corrective actions.
• Develop process recipes, test procedures and technical documentation.
• Work closely with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.
• Provide technical support, equipment installation and application support at customer sites.
• Conduct customer training and support Field Application Engineers on equipment operation.
• Liaise with customers to understand application requirements and recommend suitable semiconductor packaging solutions.
• Gather customer feedback and work with the R&D team on product improvements.

Requirements

• Bachelor's or Master's Degree in Mechanical, Electrical, Materials Engineering or a related discipline.
• Semiconductor manufacturing experience is required.
• Minimum 3 years of experience in semiconductor packaging, die bonding equipment or advanced electronics manufacturing.
• Good knowledge of advanced semiconductor packaging technologies (e.g. Flip Chip, PoP, WLP and PLP).
• Experience with semiconductor equipment, motion control systems and process development is an advantage.
• Hands-on troubleshooting and problem-solving experience in a manufacturing or laboratory environment.
• Good communication skills and able to work independently as well as in a team.
• Willing to travel for customer support, equipment installation and on-site technical assistance when required.

Company Name: Talent Recruitment Pte Ltd

EA License No: 24C2338

EA Personnel Name: Loke Sai Lye (Loke)

EA Personnel No: R24123366

Email: [e-mail]

Contact Number: 8168 8648