Principal/Staff Advanced Packaging Development Process Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Semiconductor Asia Operations PTE. LTD. in Singapore seeks an Advanced Packaging Development Process Engineer to lead wafer singulation technology development for next-generation HBM and packaging products.

You will collaborate with cross-functional teams, equipment suppliers, and material partners to enable tech development and manufacturing readiness. Responsibilities include optimizing wafer dicing methods, wafer thinning, and die separation; designing DOE plans to improve yield and

Qualifications

• Requires advanced degree in a relevant engineering/science field with several years of process development experience.
• Experience in semiconductor packaging and wafer processing technologies is essential.

Responsibilities

• Develop and optimize wafer dicing and die separation technologies.
• Support wafer thinning, grinding, mounting for advanced packaging.
• Design and execute DOE plans to improve yield and quality.
• Evaluate and qualify new dicing equipment, tooling, and materials.
• Conduct process characterization, defect analysis, and root-cause investigations.
• Drive yield improvement and troubleshooting using structured methods (KT, 5-Why, 8D).
• Collaborate with cross-functional teams to enable technology development and transfer to production.
• Monitor process health using SPC, FDC, JMP and data analytics tools.
• Partner with external suppliers to co-develop equipment and materials for future technology nodes.
• Integrate AI-enabled tools and insights into daily work to improve efficiency and quality.
• Identify and share AI-enabled enhancements within scope of work.

Skills

Wafer dicing & die separation

Data analysis & DOE/SPC/JMP

Problem solving & optimization

Cross-functional teamwork

Education

Bachelor/Master/PhD in Electrical Eng, Materials Science, Chemical Eng, Physics or related field

Tools

JMP

DOE software

SPC

Data analysis tools

Job description

RoleSummary:

The Advanced Packaging Development Process Engineer will develop and qualify wafer singulation technologies for next-generation HBM and advanced packaging products.

This position will lead dicing, thinning, and die separation process development, working closely with cross-functional teams, equipment suppliers, and material partners to enable future packaging technologies and manufacturing readiness.
Main Responsibilities:

• Develop and optimize advanced wafer singulation technologies, including blade dicing, laser grooving, stealth dicing, laser full-cut, plasma dicing, and die separation.

• Support wafer thinning, grinding, mounting, and handling processes for advanced packaging applications.

• Design and execute DOE plans to improve yield, quality, and process capability.

• Evaluate and qualify new dicing equipment, tooling, and materials.

• Conduct process characterization, defect analysis, and root-cause investigations using statistical methods.

• Drive yield improvement and process troubleshooting using structured problem-solving methodologies (KT, 5-Why, 8D).

• Collaborate with Process Integration, Reliability, Equipment, and Manufacturing teams to enable technology development and transfer to production.

• Monitor process health using SPC, FDC, JMP, and data analytics tools.

• Partner with external suppliers to co-develop equipment and materials for future technology nodes.

AI Responsibilities:

• Integrates AI-enabled tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile
Minimum Required Qualifications:

• PhD with ≥3 years or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.

• Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.

Must Have Technical Skills:

• Hands-on experience in wafer dicing, die separation, wafer thinning/grinding, or advanced packaging technologies.

• Strong knowledge of DOE, SPC, JMP, and data analysis.

• Proven problem-solving skills and experience in process optimization.

• Strong communication skills and ability to work effectively in cross-functional global teams.

Must Have Soft Skills:

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.

Embody Micron’s core values:

• People – Respect, develop, and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

• Speed – Act with purpose and set the pace