Principal/Staff Advanced Packaging Development Process Engineer

Micron; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Principal - Staff Advanced Packaging Development Process Engineer to lead wafer singulation technology development for next-generation HBM and packaging products. You will drive dicing, thinning, and die separation with cross-functional teams and suppliers.

You will apply DOE, SPC, JMP, and data analysis to improve yield and process capability while guiding technology transfer to production and AI-driven efficiency improvements.

Qualifications

• PhD with ≥3 years, or Master's with ≥5 years, or Bachelor's with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.
• Hands-on experience in wafer dicing, die separation, wafer thinning/grinding, or advanced packaging technologies.
• Strong knowledge of DOE, SPC, JMP, and data analysis.

Responsibilities

• Develop and optimize advanced wafer singulation technologies (blade dicing, laser grooving, stealth dicing, laser full-cut, plasma dicing, die separation).
• Support wafer thinning, grinding, mounting, and handling for advanced packaging applications.
• Design and execute DOE plans to improve yield, quality, and process capability.
• Evaluate and qualify new dicing equipment, tooling, and materials.
• Conduct process characterization, defect analysis, and root-cause investigations using statistical methods.
• Drive yield improvement and process troubleshooting using KT, 5-Why, and 8D methodologies.
• Collaborate with Process Integration, Reliability, Equipment, and Manufacturing teams to enable technology development and transfer to production.
• Monitor process health using SPC, FDC, JMP, and data analytics tools.
• Partner with external suppliers to co-develop equipment and materials for future technology nodes.

Skills

Wafer dicing

Die separation

Wafer thinning/grinding

Advanced packaging technologies

DOE

SPC

JMP

Data analysis

Problem solving

Education

PhD in Electrical Engineering

Master's in Electrical Engineering

Bachelor's in Electrical Engineering

Tools

JMP

SPC

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Principal - Staff Advanced Packaging Development Process Engineer Role Summary

The Advanced Packaging Development Process Engineer will develop and qualify wafer singulation technologies for next-generation HBM and advanced packaging products. This position will lead dicing, thinning, and die separation process development, working closely with cross-functional teams, equipment suppliers, and material partners to enable future packaging technologies and manufacturing readiness.

Main Responsibilities

• Develop and optimize advanced wafer singulation technologies, including blade dicing, laser grooving, stealth dicing, laser full-cut, plasma dicing, and die separation.
• Support wafer thinning, grinding, mounting, and handling processes for advanced packaging applications.
• Design and execute DOE plans to improve yield, quality, and process capability.
• Evaluate and qualify new dicing equipment, tooling, and materials.
• Conduct process characterization, defect analysis, and root-cause investigations using statistical methods.
• Drive yield improvement and process troubleshooting using structured problem-solving methodologies (KT, 5-Why, 8D).
• Collaborate with Process Integration, Reliability, Equipment, and Manufacturing teams to enable technology development and transfer to production.
• Monitor process health using SPC, FDC, JMP, and data analytics tools.
• Partner with external suppliers to co-develop equipment and materials for future technology nodes.

AI Responsibilities

Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile Minimum Required Qualifications

PhD with >=3 years or Master’s degree with >=5 years, or Bachelor’s degree with >=7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field. Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.

Must Have Technical Skills

• Hands-on experience in wafer dicing, die separation, wafer thinning/grinding, or advanced packaging technologies.
• Strong knowledge of DOE, SPC, JMP, and data analysis.
• Proven problem-solving skills and experience in process optimization.
• Strong communication skills and ability to work effectively in cross-functional global teams.

Must Have Soft Skills

• Strong analytical and problem-solving capabilities.
• Outstanding communication, leadership, and stakeholder management skills.
• Ability to work independently and collaboratively in a fast-paced environment.
• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements

Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.

Emb… core values:

• People - Respect, develop, and empower others
• Innovation - Drive continuous improvement and breakthrough thinking
• Tenacity - Show grit and determination
• Collaboration - Build trust and foster teamwork
• Customer Focus - Deliver excellence and value
• Speed - Act with purpose and set the pace

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does **not** charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all **information** provided must be accurate and reflect the candidate's true skills and experiences. Misuse of **AI** to Fabricate or …'

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