Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a senior engineer to lead process development and qualification of next-generation packaging technologies such as wafer-level and hybrid bonding.

The role involves coordinating with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality to accelerate technology readiness. The candidate will drive innovation, optimize processes, and enable smooth product transfers to high-volume manufacturing, using

Qualifications

• PhD with≥3 years or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.
• Willingness to apply AI-enabled tools and data-driven methods to optimize manufacturing processes.

Responsibilities

• Lead process development activities from concept through qualification and transfer to manufacturing.
• Collaborate with Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality to integrate manufacturing processes.
• Drive technology readiness and cost reductions through process improvements and new equipment/material evaluations.
• Ensure documentation (POR/MOR) for product transfer to high-volume manufacturing facilities.
• Integrate AI-assisted tools to improve efficiency and quality in daily work.

Skills

Python

R

SQL

Data analytics

DOE

Dashboarding

Process modeling

Analytical thinking

Education

PhD with ≥3 years, or Master’s ≥5, or Bachelor’s ≥7 in Electrical Engineering / Materials Science / Chemical Engineering / Physics or related field

Tools

Visual Basic for automation

E3

FDC

RMS

Job description

RoleSummary:

Playing a key role in developing andenabling next-generationadvanced packaging technologies for future memory and semiconductor products. This positionis responsible forprocess development, characterization, integration, and qualification of advanced assembly solutions, including hybrid bonding, thermo-compression bonding (TCB), flip chip, and emerging packaging technologies.

The engineer will lead technology development activities from concept through qualification and manufacturing transfer, working closely with cross-functional teams including Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality organizations. The successful candidate will drive technical innovation, solve complex process challenges, and accelerate technology readiness to support Micron’s advanced packaging roadmap.

Main Responsibilities:

Process Development:

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
• Upgrade process capabilities and reduce production costs
• Establish and improve process management projects to deliver technology node requirements and scaling for next node.

Equipment and Materials:

• Evaluate and promote new equipment and materials to enhance process capabilities
• Set up process parameters for a variety of semiconductor equipment
• Evaluate, promote, and plan for new equipment and materials

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms toidentifyimprovement opportunities
• Conduct continuous data analysis toestablishadvanced controls andidentifyimprovement opportunities

Collaboration and Coordination:

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes foroptimalperformance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
• Provide ProcessOfRecord (POR) and ModelOfRecord (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Required Qualifications:

• PhDwith≥3 yearsorMaster’sdegree with ≥5years, orBachelor’sdegree with ≥7years of relevant experienceinElectrical Engineering, Materials Science, Chemical Engineering, Physics, orarelatedfield.
• Demonstratedexpertisein semiconductor process development, assembly, advanced packaging, or wafer processing.

Must Have Technical Skills:

• Proficiencyin Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

Must Have Soft Skills:

• Strong analytical and problem-solving capabilities.
• Outstanding communication, leadership, and stakeholder management skills.
• Ability to work independently and collaboratively in a fast-paced environment.
• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

• Ability to apply baseline digital fluency and role‑appropriateAI literacy to useAI‑enabledtools responsibly and effectively for research, analysis, content creation,problem‑solving, operational tasks, and achieving business outcomes.

Embody Micron’s core values:

• People – Respect, develop, and empower others
• Innovation – Drive continuous improvement and breakthrough thinking
• Tenacity – Show grit and determination
• Collaboration – Build trust and foster teamwork
• Customer Focus – Deliver excellence and value
• Speed–Act with purpose and set the pace