Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an engineer to develop and enable next-generation advanced packaging technologies, including hybrid bonding and thermo-compression bonding, and to drive technology readiness for manufacturing transfer.

The role collaborates with Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality teams to accelerate innovation and optimize yield and reliability in high-volume production.

Qualifications

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Process Development: Establish and improve wafer level process conditions and technologies (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Establish and improve process management projects to deliver technology node requirements and scaling for next node.
• Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• AI Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.

Skills

Python

R

SQL

Education

PhD with ≥3 years or Master’s with ≥5 years or Bachelor’s with ≥7 years in EE/Materials/Chemical/Physics

Tools

Visual Basic for automation

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Role Summary: Playing a key role in developing and enabling next-generation advanced packaging technologies for future memory and semiconductor products. This position is responsible for process development, characterization, integration, and qualification of advanced assembly solutions, including hybrid bonding, thermo-compression bonding (TCB), flip chip, and emerging packaging technologies. The engineer will lead technology development activities from concept through qualification and manufacturing transfer, working closely with cross-functional teams including Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality organizations. The successful candidate will drive technical innovation, solve complex process challenges, and accelerate technology readiness to support Micron’s advanced packaging roadmap.

Main Responsibilities

• Process Development: Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
• Upgrade process capabilities and reduce production costs
• Establish and improve process management projects to deliver technology node requirements and scaling for next node.
• Equipment and Materials: Evaluate and promote new equipment and materials to enhance process capabilities
• Set up process parameters for a variety of semiconductor equipment
• Evaluate, promote, and plan for new equipment and materials
• Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
• Collaboration and Coordination: Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
• AI Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile Minimum Required Qualifications

PhD with ≥3 years or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field. Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.

Must Have Technical Skills

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

Must Have Soft Skills

• Strong analytical and problem-solving capabilities.
• Outstanding communication, leadership, and stakeholder management skills.
• Ability to work independently and collaboratively in a fast-paced environment.
• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements

Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes. Embody Micron’s core values: People – Respect, develop, and empower others Innovation – Drive continuous improvement and breakthrough thinking Tenacity – Show grit and determination Collaboration – Build trust and foster teamwork Customer Focus – Deliver excellence and value Speed – Act with purpose and set the pace

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail] Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.